PBSS2540MB: 40 V, 0.5 A NPN low VCEsat (BISS) transistor

NPN low VCEsat Breakthrough In Small Signal (BISS) transistor in a leadless ultra small DFN1006B-3 (SOT883B) Surface-Mounted Device (SMD) plastic package. PNP complement: PBSS3540MB.

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Data Sheets (1)
Name/DescriptionModified Date
40 V, 0.5 A NPN low VCEsat (BISS) transistor (REV 1.0) PDF (465.0 kB) PBSS2540MB11 Apr 2012
Application Notes (2)
Name/DescriptionModified Date
Next generation of NXP® low VCEsat transistors: improved technology for discrete semiconductors (REV 3.0) PDF (1.3 MB) AN1104504 Mar 2013
Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN1107612 Jul 2011
Package Information (1)
Name/DescriptionModified Date
DFN1006B-3: leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm (REV 1.0) PDF (181.0 kB) SOT883B08 Feb 2016
Packing (1)
Name/DescriptionModified Date
Leadless ultra small package; Reel pack, SMD, 7" Q3/T4 standard product orientation Orderable part number ending... (REV 1.0) PDF (206.0 kB) SOT883B_31522 Jul 2016
Reliability and Quality Information (2)
Name/DescriptionModified Date
PBSS2540MB NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS2540MB_131 Jan 2015
PBSS2540MB NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS2540MB_NXP_PRODUCT_QUALITY31 Jan 2015
Supporting Information (1)
Name/DescriptionModified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE30 Sep 2013
SPICE model
Ordering Information
ProductStatusPackage versionPackage nameSize (mm)Transistor polaritytransistor polaritynumber of transistorsPtot [max] (mW)VCEO [max] (V)IC [max] (A)ICM [max] (A)hFE [min]hFE [typ]fT [typ] (MHz)fT [min] (MHz)RCEsat [typ] (mΩ)VCEsat [max] (mV)RCEsat [max] (mΩ)
PBSS2540MBActiveSOT883BDFN1006B-31 x 0.6 x 0.37NPN1250400.51200450250380250500
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateEFRIFR(FIT)MTBF(hour)MSLMSL LF
PBSS2540MBSOT883BReflow_Soldering_ProfileReel 7" Q1/T1 Pitch 2mmActivePBSS2540MB,315 (9340 658 76315)0001 0010PBSS2540MBAlways Pb-free153.00.711.41E911
40 V, 0.5 A NPN low VCEsat (BISS) transistor PBSS2540MB
Next generation of NXP® low VCEsat transistors: improved technology for discrete semiconductors PBSS4041SPN
Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z
PBSS2540MB NXP® Product Reliability PBSS2540MB
PBSS2540MB NXP Product Quality PBSS2540MB
PBSS2540MB SPICE model PBSS2540MB
DFN1006B-3: leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm BC857BMB
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Leadless ultra small package; Reel pack, SMD, 7" Q3/T4 standard product orientation Orderable part number ending... BC857BMB
PMZB950UPE