PBSS302NZ: 20 V, 5.8 A NPN low VCEsat (BISS) transistor

NPN low VCEsat Breakthrough In Small Signal (BISS) transistor in a SOT223 (SC-73) small Surface-Mounted Device (SMD) plastic package.

PNP complement: PBSS302PZ.

PBSS302NZ: Product Block Diagram
PBSS302NZ: Block Diagram
SOT223
Data Sheets (1)
Name/DescriptionModified Date
20 V, 5.8 A NPN low VCEsat (BISS) transistor (REV 2.0) PDF (164.0 kB) PBSS302NZ08 Dec 2009
Application Notes (1)
Name/DescriptionModified Date
Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN1107612 Jul 2011
Package Information (1)
Name/DescriptionModified Date
plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT22308 Feb 2016
Packing (1)
Name/DescriptionModified Date
Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (189.0 kB) SOT223_13507 Nov 2012
Reliability and Quality Information (2)
Name/DescriptionModified Date
PBSS302NZ NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS302NZ_131 Jan 2015
PBSS302NZ NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS302NZ_NXP_PRODUCT_QUALITY31 Jan 2015
Supporting Information (2)
Name/DescriptionModified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE30 Sep 2013
SPICE model
Ordering Information
ProductStatusPackage versionPackage nameSize (mm)Transistor polaritytransistor polarityPtot [max] (mW)number of transistorsVCEO [max] (V)IC [max] (A)ICM [max] (A)hFE [min]hFE [typ]fT [typ] (MHz)RCEsat [typ] (mΩ)VCEsat [max] (mV)RCEsat [max] (mΩ)
PBSS302NZActiveSOT223SC-736.5 x 3.5 x 1.65NPN7001205.811.63005701400.030.03825043
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateEFRIFR(FIT)MTBF(hour)MSLMSL LF
PBSS302NZSOT223Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 11¼" Q1/T1 in LargePackActivePBSS302NZ,135 (9340 590 43135)S302NZPBSS302NZAlways Pb-free153.00.711.41E911
20 V, 5.8 A NPN low VCEsat (BISS) transistor PBSS302NZ
Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z
PBSS302NZ NXP® Product Reliability PBSS302NZ
PBSS302NZ NXP Product Quality PBSS302NZ
PBSS302NZ SPICE model PBSS302NZ
plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55
PBHV9115Z
BLT81