PBSS306NZ: 100 V, 5.1 A NPN low VCEsat (BISS) transistor
NPN low VCEsat Breakthrough In Small Signal (BISS) transistor in a SOT223 (SC-73) small Surface-Mounted Device (SMD) plastic package.
PNP complement: PBSS306PZ.
PBSS306NZ: Product Block Diagram
PBSS306NZ: Block Diagram
SOT223
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 100 V, 5.1 A NPN low V_CEsat (BISS) transistor (REV 2.1) PDF (186.0 kB) PBSS306NZ | 28 Jan 2010 |
Application Notes (1)
| Name/Description | Modified Date |
|---|---|
| Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076 | 12 Jul 2011 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (189.0 kB) SOT223_135 | 07 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PBSS306NZ NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS306NZ_1 | 31 Jan 2015 |
| PBSS306NZ NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS306NZ_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Supporting Information (2)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
SPICE model
- PBSS306NZ SPICE model (REV 1.4) prm PBSS306NZ_1_2 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | transistor polarity | Transistor polarity | number of transistors | Ptot [max] (mW) | VCEO [max] (V) | IC [max] (A) | ICM [max] (A) | hFE [min] | hFE [typ] | fT [typ] (MHz) | RCEsat [typ] (mΩ) | VCEsat [max] (mV) | RCEsat [max] (mΩ) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS306NZ | Active | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | NPN | 1 | 700 | 100 | 5.1 | 10.2 | 200 | 330 | 110 | 43 | 300 | 60 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS306NZ | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11¼" Q1/T1 in LargePack | Active | PBSS306NZ,135 (9340 590 47135) | S306NZ | PBSS306NZ |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
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- PBSS306NZ SPICE model PBSS306NZ
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- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
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- Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55
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