PBSS5350SS: 50 V, 2.7 A PNP/PNP low VCEsat (BISS) transistor
PNP/PNP double low VCEsat Breakthrough In Small Signal (BISS) transistor in a medium power Surface-Mounted Device (SMD) plastic package.
PBSS5350SS: Product Block Diagram
PBSS5350SS: Block Diagram
sot096-1_3d
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 50 V, 2.7 A PNP/PNP low V_CEsat (BISS) transistor (REV 1.0) PDF (101.0 kB) PBSS5350SS | 12 Oct 2016 |
Application Notes (1)
| Name/Description | Modified Date |
|---|---|
| Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076 | 12 Jul 2011 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic small outline package; 8 leads; body width 3.9 mm (REV 1.0) PDF (244.0 kB) SOT96-1 | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (222.0 kB) SOT96-1_115 | 23 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PBSS5350SS NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS5350SS_1 | 31 Jan 2015 |
| PBSS5350SS NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS5350SS_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Supporting Information (3)
| Name/Description | Modified Date |
|---|---|
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
| Footprint for reflow soldering (REV 1.0) PDF (9.0 kB) SO-SOJ-REFLOW | 08 Oct 2009 |
| Footprint for wave soldering (REV 1.0) PDF (8.0 kB) SO-SOJ-WAVE | 08 Oct 2009 |
SPICE model
- PBSS5350SS SPICE model (REV 1.4) prm PBSS5350SS_1_2 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | Transistor polarity | transistor polarity | Ptot [max] (mW) | number of transistors | Polarity | VCEO [max] (V) | IC [max] (A) | ICM [max] (A) | hFE [min] | hFE [typ] | fT [typ] (MHz) | VCEsat [max] (PNP) (mV) | RCEsat@IC [max]; IC/IB =10 [typ] (mΩ) | RCEsat [typ] (mΩ) | VCEsat [max] (mV) | RCEsat [max] (mΩ) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS5350SS | Active | SOT96-1 | SO8 | 4.9 x 3.9 x 1.75 | PNP | 750 | 2 | PNP | -50 | -2.7 | -5 | 200 | 340 | -370 | 140.00000000000001 | 95 | -90 | 140 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS5350SS | | SOT96-1 | SO-SOJ-REFLOW
SO-SOJ-WAVE SO-SOJ-REFLOW SO-SOJ-WAVE | Reel 7" Q1/T1 | Active | PBSS5350SS,115 (9340 610 32115) | 5350SS | PBSS5350SS |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z
- PBSS5350SS NXP® Product Reliability PBSS5350SS
- PBSS5350SS NXP Product Quality PBSS5350SS
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- PBSS5350SS SPICE model PBSS5350SS
- plastic small outline package; 8 leads; body width 3.9 mm CBT3306_Q100
- Footprint for reflow soldering NPIC6C596A_Q100
- Footprint for wave soldering NPIC6C596A_Q100
- Tape reel SMD; standard product orientation 12NC ending 115 PBSS5350SS
- PBSS5350SS
- PBSS5350SS
- SA612A
