PBSS5360Z: 60 V, 3 A PNP low VCEsat (BISS) transistor

PNP low VCEsat Breakthrough In Small Signal (BISS) transistor in a medium power SOT223 (SC-73) Surface-Mounted Device (SMD) plastic package.

NPN complement: PBSS4360Z.

SOT223
Data Sheets (1)
Name/DescriptionModified Date
60 V, 3 A PNP low VCEsat (BISS) transistor (REV 1.0) PDF (257.0 kB) PBSS5360Z19 Feb 2014
Package Information (1)
Name/DescriptionModified Date
plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT22308 Feb 2016
Packing (1)
Name/DescriptionModified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_11507 Nov 2012
Reliability and Quality Information (2)
Name/DescriptionModified Date
PBSS5360Z NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS5360Z_131 Jan 2015
PBSS5360Z NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS5360Z_NXP_PRODUCT_QUALITY31 Jan 2015
Supporting Information (2)
Name/DescriptionModified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE30 Sep 2013
SPICE model
Ordering Information
ProductStatusPackage versionPackage nameSize (mm)Transistor polaritytransistor polarityPtot [max] (mW)number of transistorsVCEO [max] (V)IC [max] (A)ICM [max] (A)hFE [min]hFE [typ]fT [min] (MHz)fT [typ] (MHz)RCEsat [typ] (mΩ)VCEsat [max] (mV)RCEsat [max] (mΩ)
PBSS5360ZActiveSOT223SC-736.5 x 3.5 x 1.65PNP6501-60-3-615065130-150225
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateEFRIFR(FIT)MTBF(hour)MSLMSL LF
PBSS5360ZSOT223Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q1/T1ActivePBSS5360ZX (9340 682 08115)P5360ZPBSS5360ZAlways Pb-free153.00.711.41E911
60 V, 3 A PNP low VCEsat (BISS) transistor PBSS5360Z
PBSS5360Z NXP® Product Reliability PBSS5360Z
PBSS5360Z NXP Product Quality PBSS5360Z
PBSS5360Z SPICE model PBSS5360Z
plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A
BLT81