PESD5V0X2UAM: Ultra low capacitance unidirectional double ESD protection diode
Ultra low capacitance unidirectional double ElectroStatic Discharge (ESD) protection diode in a DFN1006-3 (SOT883) leadless ultra small Surface-Mounted Device (SMD) plastic package designed to protect up to two signal lines from the damage caused by ESD and other transients.
SOT883
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| Ultra low capacitance unidirectional double ESD protection diode (REV 1.0) PDF (205.0 kB) PESD5V0X2UAM [English] | 10 Apr 2014 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| DFN1006-3: leadless ultra small plastic package; 3 solder lands (REV 1.0) PDF (181.0 kB) SOT883 [English] | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... (REV 2.0) PDF (150.0 kB) SOT883_315 [English] | 22 Jul 2016 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PESD5V0X2UAM NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PESD5V0X2UAM_1 [English] | 31 Jan 2015 |
| PESD5V0X2UAM NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD5V0X2UAM_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE model
- PESD5V0X2UAM SPICE model (REV 1.0) TXT PESD5V0X2UAM_1_2 3/5/2014
Ordering Information
| Product | Status | Application | No of protected lines | HighSpeed D+/- | CC, SBU | Configuration | Cd [typ] (pF) | Cd [max] (pF) | VRWM (V) | Package version | Package name | IRM [max] (µA) | Size (mm) | VESD IEC61000-4-2 (kV) | IPPM @8/20µs [max] (A) | Remarks |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PESD5V0X2UAM | Active | ESD protection | 2 | yes | yes | Unidirectional | 0.8 | SOT883 | DFN1006-3 | 1.0 x 0.6 x 0.5 | 15 | 2.5 | 0.37 thickness: UAMB |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PESD5V0X2UAM | | SOT883 | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | PESD5V0X2UAMYL (9340 681 82315) | ZJ | PESD5V0X2UAM |    | Always Pb-free | 244.0 | 1.13 | 8.85E8 | 1 | 1 |
- PESD5V0X2UAM NXP® Product Reliability PESD5V0X2UAM
- PESD5V0X2UAM NXP® Product Quality PESD5V0X2UAM
- PESD5V0X2UAM SPICE model PESD5V0X2UAM
- DFN1006-3: leadless ultra small plastic package; 3 solder lands BSS84AKM
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... BSS84AKM
- PMZ950UPE
