PMEG2020AEA: 20 V, 2 A very low VF MEGA Schottky barrier rectifier in SOD323 (SC-76) package
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD323 (SC-76) very small SMD plastic package.
PMEG2020AEA: Product Block Diagram
sod323_3d
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 20 V, 2 A very low VF MEGA Schottky barrier rectifier in SOD323 (SC-76) package (REV 1.0) PDF (209.0 kB) PMEG2020AEA | 26 Feb 2004 |
Selector Guides (1)
| Name/Description | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 | 17 Feb 2016 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; 2 leads (REV 1.0) PDF (200.0 kB) SOD323 | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Tape reel; standard product orientation 12NC ending 115 (REV 1.0) PDF (183.0 kB) SOD323_115 | 07 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PMEG2020AEA NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PMEG2020AEA_1 | 31 Jan 2015 |
| PMEG2020AEA NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMEG2020AEA_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Supporting Information (2)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
SPICE model
- PMEG2020AEA SPICE model (REV 1.4) prm PMEG2020AEA_1_2 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | IF (A) | VR (V) | Configuration | IR [max] (mA) | IFSM [max] (A) | Cd [max] (pF) | VF [max] (mV) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| PMEG2020AEA | Active | SOD323 | SOD323 | 1.7 x 1.25 x 0.95 | 2 | 20 | single | 0,2@VR=20V | 9 | 70@VR=5V | 525@IF=2A |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PMEG2020AEA | | SOD323 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | PMEG2020AEA,115 (9340 579 33115) | S3 | PMEG2020AEA |    | Always Pb-free | 157.0 | 0.73 | 1.37E9 | 1 | 1 |
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- PMEG2020AEA NXP® Product Reliability PMEG2020AEA
- PMEG2020AEA NXP® Product Quality PMEG2020AEA
- PMEG2020AEA SPICE model PMEG2020AEA
- plastic surface-mounted package; 2 leads pesd5v0v1ba
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel; standard product orientation 12NC ending 115 pesd5v0v1ba
- PMEGXX10BEA_PMEGXX10BEV
- BB208-03
