PMEG3020EPA: 2 A low V_F MEGA Schottky barrier rectifier

Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection. PMEG3020EPA is encapsulated in an ultra thin SOT1061 leadless small Surface-Mounted Device (SMD) plastic package with medium power capability.

Outline 3d SOT1061
Data Sheets (1)
Name/DescriptionModified Date
2 A low V_F MEGA Schottky barrier rectifier (REV 1.0) PDF (152.0 kB) PMEG3020EPA24 Dec 2009
Application Notes (1)
Name/DescriptionModified Date
Leadless Schottky diodes in a DC-to-DC step-up converter (REV 1.1) PDF (562.0 kB) AN1147006 Mar 2015
Brochures (1)
Name/DescriptionModified Date
1 and 2 A Schottky rectifiers in leadless medium-power package; NXP® low VF (MEGA) Schottky rectifier... (REV 1.0) PDF (2.6 MB) 7501742520 Apr 2013
Selector Guides (1)
Name/DescriptionModified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 7501763117 Feb 2016
Package Information (1)
Name/DescriptionModified Date
DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (185.0 kB) SOT106108 Feb 2016
Packing (1)
Name/DescriptionModified Date
DFN2020-3; reel pack; standard product orientation; 12NC ending 115 (REV 1.0) PDF (261.0 kB) SOT1061_11507 Nov 2012
Reliability and Quality Information (2)
Name/DescriptionModified Date
PMEG3020EPA NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PMEG3020EPA_131 Jan 2015
PMEG3020EPA NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMEG3020EPA_NXP_PRODUCT_QUALITY31 Jan 2015
Supporting Information (1)
Name/DescriptionModified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE30 Sep 2013
SPICE model
Ordering Information
ProductStatusPackage versionPackage nameSize (mm)IF (A)VR (V)ConfigurationIR [max] (mA)IFSM [max] (A)Cd [max] (pF)VF [max] (mV)
PMEG3020EPAActiveSOT1061DFN2020-32 x 2 x 0.65230single2,5@VR=30V1755@VR=10V470@IF=2A
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateEFRIFR(FIT)MTBF(hour)MSLMSL LF
PMEG3020EPASOT1061Reflow_Soldering_ProfileReel 7" Q1/T1ActivePMEG3020EPA,115 (9340 634 85115)A2PMEG3020EPAAlways Pb-free157.00.731.37E911
2 A low V_F MEGA Schottky barrier rectifier PMEG3020EPA
Leadless Schottky diodes in a DC-to-DC step-up converter PMEG6020EPA
1 and 2 A Schottky rectifiers in leadless medium-power package; NXP® low VF (MEGA) Schottky rectifier... PMEG6020EPA
Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
PMEG3020EPA NXP® Product Reliability PMEG3020EPA
PMEG3020EPA NXP® Product Quality PMEG3020EPA
PMEG3020EPA SPICE model PMEG3020EPA
DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm PMEG6020EPA
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
DFN2020-3; reel pack; standard product orientation; 12NC ending 115 PMEG6020EPA
PTVSXU1UPA_SERIES