PMEG6010CPA: 1 A low V_F dual MEGA Schottky barrier rectifier

Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier in common cathode configuration with an integrated guard ring for stress protection, encapsulated in a SOT1061 leadless small Surface-Mounted Device (SMD) plastic package with medium power capability.

Outline 3d SOT1061
Data Sheets (1)
Name/DescriptionModified Date
1 A low V_F dual MEGA Schottky barrier rectifier (REV 1.0) PDF (320.0 kB) PMEG6010CPA07 Sep 2010
Application Notes (1)
Name/DescriptionModified Date
Leadless Schottky diodes in a DC-to-DC step-up converter (REV 1.1) PDF (562.0 kB) AN1147006 Mar 2015
Brochures (1)
Name/DescriptionModified Date
1 and 2 A Schottky rectifiers in leadless medium-power package; NXP® low VF (MEGA) Schottky rectifier... (REV 1.0) PDF (2.6 MB) 7501742520 Apr 2013
Selector Guides (1)
Name/DescriptionModified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 7501763117 Feb 2016
Package Information (1)
Name/DescriptionModified Date
DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (185.0 kB) SOT106108 Feb 2016
Packing (1)
Name/DescriptionModified Date
DFN2020-3; reel pack; standard product orientation; 12NC ending 115 (REV 1.0) PDF (261.0 kB) SOT1061_11507 Nov 2012
Reliability and Quality Information (2)
Name/DescriptionModified Date
PMEG6010CPA NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PMEG6010CPA_131 Jan 2015
PMEG6010CPA NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMEG6010CPA_NXP_PRODUCT_QUALITY31 Jan 2015
Supporting Information (1)
Name/DescriptionModified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE30 Sep 2013
SPICE model
Ordering Information
ProductStatusPackage versionPackage nameSize (mm)IF (A)VR (V)ConfigurationIR [max] (mA)IFSM [max] (A)Cd [max] (pF)VF [max] (mV)
PMEG6010CPAActiveSOT1061DFN2020-32 x 2 x 0.65160dual c.c.0,1@VR=60V940@VR=10V540@IF=1A
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateEFRIFR(FIT)MTBF(hour)MSLMSL LF
PMEG6010CPASOT1061Reflow_Soldering_ProfileReel 7" Q1/T1ActivePMEG6010CPA,115 (9340 643 49115)APPMEG6010CPAAlways Pb-free157.00.731.37E911
1 A low V_F dual MEGA Schottky barrier rectifier PMEG6010CPA
Leadless Schottky diodes in a DC-to-DC step-up converter PMEG6020EPA
1 and 2 A Schottky rectifiers in leadless medium-power package; NXP® low VF (MEGA) Schottky rectifier... PMEG6020EPA
Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
PMEG6010CPA NXP® Product Reliability PMEG6010CPA
PMEG6010CPA NXP® Product Quality PMEG6010CPA
PMEG6010CPA SPICE model PMEG6010CPA
DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm PMEG6020EPA
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
DFN2020-3; reel pack; standard product orientation; 12NC ending 115 PMEG6020EPA
PTVSXU1UPA_SERIES