PUSBM5V5X4-TL: High-speed USB OTG ESD protection diode arrays

PUSBMxX4-TL is a series of four 4-channel ElectroStatic Discharge (ESD) diode arrays for USB 2.0 (On-The-Go (OTG)) interfaces. The devices provide protection to downstream components from ESD voltages up to ±8 kV contact discharge. They offer three low capacitance ESD protection pins and one VBUS protection diode. They are encapsulated in an ultra thin DFN1616-6 (SOT1189-1/XSON6) plastic package with 0.5 mm pitch. These features make the devices ideal for use in applications requiring component miniaturization, such as mobile phone handsets.

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High-speed USB 2.0 and USB OTG connector ESD protection in:

  • Cellular phone and Personal Communication System (PCS) mobile handsets

  • Portable media players

Data Sheets (1)
Name/DescriptionModified Date
High-speed USB OTG ESD protection diode arrays (REV 3.0) PDF (525.0 kB) PUSBMXX4-TL_SER [English]14 Jun 2012
Application Notes (1)
Name/DescriptionModified Date
ESD protection for USB 2.0 interfaces (REV 3.0) PDF (264.0 kB) AN10753 [English]07 Feb 2013
Brochures (2)
Name/DescriptionModified Date
只需一个器件,即可对 USB OTG 和 Vbus... (REV 2.0) PDF (1.2 MB) 75017273 [English]11 May 2012
Protect USB On-The-Go and the Vbus charger from ESD with just one device (REV 2.0) PDF (647.0 kB) 75017196 [English]25 Apr 2012
Package Information (1)
Name/DescriptionModified Date
DFN1616-6: plastic, thermal enhanced extremely thin small outline package; no leads; 6 terminals (REV 1.0) PDF (190.0 kB) SOT1189-1 [English]08 Feb 2016
Reliability and Quality Information (2)
Name/DescriptionModified Date
PUSBM5V5X4-TL NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PUSBM5V5X4-TL [English]31 Jan 2015
PUSBM5V5X4-TL NXP® Product Quality (REV 1.1) PDF (74.0 kB) PUSBM5V5X4-TL_PRODUCT_QUALITY [English]31 Jan 2015
Supporting Information (1)
Name/DescriptionModified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Ordering Information
ProductStatusPackage versionPackage nameSize (mm)No of protected linesConfigurationCd [typ] (pF)Cd [max] (pF)VRWM (V)VESD IEC61000-4-2 (kV)IRM [max] (µA)Recommended for
PUSBM5V5X4-TLActiveSOT1189-1DFN1616-61.6 x 1.6 x 0.53Rail-to-Rail1.11.35.581USB On The Go, Vbus 5,5 V
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateEFRIFR(FIT)MTBF(hour)MSLMSL LF
PUSBM5V5X4-TLSOT1189-1Reflow_Soldering_ProfileReel 7" Q1/T1ActivePUSBM5V5X4-TL,115 (9340 656 08115)Standard MarkingPUSBM5V5X4-TLAlways Pb-free244.01.138.85E811
High-speed USB OTG ESD protection diode arrays PUSBMXX4_TL_SERIES
ESD protection for USB 2.0 interfaces prtr5v0u2x
只需一个器件,即可对 USB OTG 和 Vbus... PUSBMXX4_TL_SERIES
Protect USB On-The-Go and the Vbus charger from ESD with just one device PUSBMXX4_TL_SERIES
PUSBM5V5X4-TL NXP® Product Reliability PUSBM5V5X4-TL
PUSBM5V5X4-TL NXP® Product Quality PUSBM5V5X4-TL
DFN1616-6: plastic, thermal enhanced extremely thin small outline package; no leads; 6 terminals bgu7258
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
BGU7258