SL3ICS3001: UCODE® HSL

The UCODE® HSL IC (UCODE High frequency Smart Label) is a dedicated chip for passive, intelligent tags and labels, especially for supply chain management and logistics applications in the US, where operating distances of several meters can be realized. Further, the UCODE HSL technology platform is also designed for operation under European regulations.

This integrated circuit is the first member of a product family of smart label ICs targeted to be compliant with the future ISO standards 18000-4 and 18000-6 for item management.

The UCODE system offers the possibility of operating labels simultaneously in the field of the reader antenna (Anticollision, Collision Arbitration).

The UCODE HSL family of ICs is especially designed for long range applications.

The tag requires no internal power supply. Its contactless interface generates the power supply via the antenna circuit by propagative energy transmission from the interrogator (read/write device), while the system clock is generated by an on-board oscillator. The contactless interface demodulates data transmitted from the interrogator to the UCODE HSL based tag, and further modulates the electromagnetic field provided by the interrogator for data transmission from the UCODE HSL based tag to the interrogator.

RF Interface
  • Contactless transmission of data and supply energy (no battery needed)
  • Operating distance, depending on antenna geometry and local regulations, up to 8.4 m for a single antenna.
  • Operating frequency within the released operating bands from 860 MHz to 960 MHz and 2.4 GHz to 2.5 GHz.
  • High data integrity: 16 bit CRC, framing
  • True aniticollision for collision arbitration
  • Write distance 70% of reading distance
Memory
  • 2048 bits
  • 64 bits UID in memory bytes 0 to 7.
  • 216 bytes with user definable access conditions for memory bytes 8 to 223
  • Data retention of 10 years
  • Write endurance of 100 kcycles
Security
  • Unique serial number for each device
  • Lock mechanism (write protection) for each byte
Data Sheets (1)
Name/DescriptionModified Date
SL3ICS3001, UCODE® HSL (REV 3.1) PDF (364.0 kB) SL3ICS3001_07283110 Jul 2012
Application Notes (1)
Name/DescriptionModified Date
Handling and processing of sawn wafers on UV dicing tape (REV 1.0) PDF (47.0 kB) 10692022 Dec 2009
Brochures (2)
Name/DescriptionModified Date
RFID for brand protection - secure your most valuable assets & increase customer engagement (REV 1.0) PDF (4.7 MB) 7501759517 Dec 2014
RFID for retail: Now is the time to invest (REV 1.0) PDF (1.3 MB) 7501762817 Dec 2014
Supporting Information (2)
Name/DescriptionModified Date
Data sheet addendum; SL3ICS3001 UCODE HSL bumped wafer specification (REV 3.1) PDF (297.0 kB) 07073005 Dec 2012
Ordering Information
Product
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateMSLMSL LF
SL3ICS3001FW/V1Wafer, Sawn on FFC, Non-ConductiveWithdrawnSL3ICS3001FW/V1,00 (9352 894 22005)Standard MarkingAlways Pb-freeNANA
SL3ICS3001, UCODE® HSL SL3ICS3001
Handling and processing of sawn wafers on UV dicing tape SL3ICS3001
RFID for brand protection - secure your most valuable assets & increase customer engagement htrc11001t
RFID for retail: Now is the time to invest sl3s1013fud
Data sheet addendum; SL3ICS3001 UCODE HSL bumped wafer specification SL3ICS3001