BAS86: Schottky barrier single diode
Planar Schottky barrier diode with an integrated guard ring for stress protection, encapsulated in a small hermetically sealed SOD80C glass Surface-Mounted Device (SMD) package with tin-plated metal discs at each end. It is suitable for “automatic placement” and as such it can withstand immersion soldering.
sod080c_3d
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| Schottky barrier single diode (REV 5.0) PDF (139.0 kB) BAS86 [English] | 25 Jul 2012 |
Selector Guides (1)
| Name/Description | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English] | 17 Feb 2016 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| hermetically sealed glass surface-mounted package; 2 connectors (REV 1.0) PDF (177.0 kB) SOD80C [English] | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (182.0 kB) SOD80C_115 [English] | 07 Nov 2012 |
Reliability and Quality Information (1)
| Name/Description | Modified Date |
|---|---|
| BAS86 NXP Product Quality (REV 1.2) PDF (74.0 kB) BAS86_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
Supporting Information (2)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | VR [max] (V) | IF [max] (mA) | IFSM [max] (A) | Configuration | VF [max] (mV) | Cd [max] (pF) | IR [max] (mA) | IR [max] (µA) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAS86 | Active | SOD80C | LLDS; MiniMelf | 3.5 x 1.5 | 50 | 200 | 5 | single | 450@IF=10mA | 8@VR=1V | 5@VR=40V |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAS86 | | SOD80C | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | BAS86,115 (9339 393 80115) | marking band | BAS86 |   | 881.0 | 4.09 | 2.44E8 | 1 | 1 |
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- BAS86 NXP Product Quality BAS86
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- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reel 7" Q1/T1 BZV55-C3V9
- BZV55_SERIES
