BCP51; BCX51; BC51PA: 45 V, 1 A PNP medium power transistors
PNP medium power transistor series in Surface-Mounted Device plastic packages.
SOT089
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 45 V, 1A PNP medium power transistors (REV 9.0) PDF (230.0 kB) BCP51_BCX51_BC51PA [English] | 24 Oct 2011 |
Application Notes (1)
| Name/Description | Modified Date |
|---|---|
| Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... (REV 1.0) PDF (400.0 kB) AN10405 [English] | 06 Jan 2006 |
Brochures (1)
| Name/Description | Modified Date |
|---|---|
| Medium-power general-purpose transistors (REV 1.0) PDF (892.0 kB) 75017660 [English] | 26 May 2015 |
Package Information (3)
| Name/Description | Modified Date |
|---|---|
| DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (185.0 kB) SOT1061 [English] | 08 Feb 2016 |
| plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 [English] | 08 Feb 2016 |
| plastic surface-mounted package; die pad for good heat transfer; 3 leads (REV 1.0) PDF (193.0 kB) SOT89 [English] | 08 Feb 2016 |
Packing (5)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (178.0 kB) SOT89_115 [English] | 28 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (178.0 kB) SOT89_135 [English] | 28 Nov 2012 |
| DFN2020-3; reel pack; standard product orientation; 12NC ending 115 (REV 1.0) PDF (261.0 kB) SOT1061_115 [English] | 07 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115 [English] | 07 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (189.0 kB) SOT223_135 [English] | 07 Nov 2012 |
Reliability and Quality Information (18)
| Name/Description | Modified Date |
|---|---|
| BC51-10PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC51-10PA [English] | 31 Jan 2015 |
| BC51-10PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC51-10PA_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BC51-16PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC51-16PA [English] | 31 Jan 2015 |
| BC51-16PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC51-16PA_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BC51PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC51PA_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BC51PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC51PA_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BCP51-10 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP51-10_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCP51-10 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP51-10_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BCP51-16 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP51-16_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCP51-16 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP51-16_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BCP51 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP51_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCP51 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP51_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BCX51-10 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCX51-10_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCX51-10 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCX51-10_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BCX51-16 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCX51-16_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCX51-16 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCX51-16_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BCX51 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCX51_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCX51 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCX51_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
Supporting Information (2)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
Design Support
- Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999
- Power Derating Curves for SMDs; General (REV 0.1) PDF DERATSMD_1 5/7/1999
SPICE model
- BC51-10PA SPICE model (REV 1.4) prm BC51-10PA_1 7/22/2012
- BC51-16PA SPICE model (REV 1.4) prm BC51-16PA_1 7/22/2012
- BC51PA SPICE model (REV 1.4) prm BC51PA 7/22/2012
- BCP51 SPICE model (REV 1.4) prm BCP51_1 7/22/2012
- BCP51-10 SPICE model (REV 1.4) prm BCP51-10 7/22/2012
- BCP51-16 SPICE model (REV 1.4) prm BCP51-16 7/22/2012
- BCX51 SPICE model (REV 1.4) prm BCX51 7/22/2012
- BCX51-10 SPICE model (REV 1.4) prm BCX51-10 7/22/2012
- BCX51-16 SPICE model (REV 1.4) prm BCX51-16 7/22/2012
Software
- BCP51_1_2 (REV 0.1) olb BCP51_1_2 11/21/2008
Ordering Information
| Product | Status |
|---|---|
| BCP51 | Active |
| BC51-16PA | Active |
| BCX51 | Active |
| BCX51-16 | Active |
| BCX51-10 | Active |
| BCP51-10 | Active |
| BCP51-16 | Active |
| BC51-10PA | Active |
| BC51PA | Active |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC51-16PA |  | SOT1061 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | BC51-16PA,115 (9340 658 16115) | BR | BC51-16PA |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| BCP51 |  | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | BCP51,115 (9339 172 70115) | BCP51 | BCP51 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| BCP51-10 | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11¼" Q1/T1 in LargePack | Active | BCP51-10,135 (9339 172 80135) | BCP51/10 | BCP51-10 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| BC51PA | | SOT1061 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | BC51PA,115 (9340 658 14115) | BP | BC51PA | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| BCX51-16 | | SOT89 | Reel 11¼" Q1/T1 in LargePack | Active | BCX51-16,135 (9336 747 10135) | AD | BCX51-16 | | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | |
| Reel 7" Q1/T1 | Active | BCX51-16,115 (9336 747 10115) | AD | BCX51-16 | | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||||
| BCX51-10 | | SOT89 | Reel 11¼" Q1/T1 in LargePack | Active | BCX51-10F (9336 630 40135) | AC | BCX51-10 | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 | |
| Reel 7" Q1/T1 | Active | BCX51-10,115 (9336 630 40115) | AC | BCX51-10 | | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||||
| BCX51 | | SOT89 | Reel 7" Q1/T1 | Active | BCX51,115 (9332 722 80115) | AA | BCX51 | | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | |
| BCP51-16 | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11¼" Q1/T1 in LargePack | Active | BCP51-16,135 (9339 172 90135) | BCP51/16 | BCP51-16 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 7" Q1/T1 | Active | BCP51-16,115 (9339 172 90115) | BCP51/16 | BCP51-16 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||||
| BC51-10PA | | SOT1061 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | BC51-10PA,115 (9340 658 15115) | BQ | BC51-10PA | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... BCX56-16
- Medium-power general-purpose transistors BSR43
- BC51-10PA NXP® Product Reliability BC51-10PA
- BC51-10PA NXP Product Quality BC51-10PA
- BC51-16PA NXP® Product Reliability BC51-16PA
- BC51-16PA NXP Product Quality BC51-16PA
- BC51PA NXP Product Quality BC51PA
- BC51PA NXP® Product Reliability BC51PA
- BCP51-10 NXP Product Quality BCP51-10
- BCP51-10 NXP® Product Reliability BCP51-10
- BCP51-16 NXP Product Quality BCP51-16
- BCP51-16 NXP® Product Reliability BCP51-16
- BCP51 NXP Product Quality BCP51
- BCP51 NXP® Product Reliability BCP51
- BCX51-10 NXP Product Quality BCX51-10
- BCX51-10 NXP® Product Reliability BCX51-10
- BCX51-16 NXP Product Quality BCX51-16
- BCX51-16 NXP® Product Reliability BCX51-16
- BCX51 NXP Product Quality BCX51
- BCX51 NXP® Product Reliability BCX51
- Letter Symbols - Transistors; General PEMD16
- Power Derating Curves for SMDs; General BST62
- BC51-10PA SPICE model BCP51_BCX51_BC51PA
- BC51-16PA SPICE model BCP51_BCX51_BC51PA
- BC51PA SPICE model BCP51_BCX51_BC51PA
- BCP51 SPICE model BCP51_BCX51_BC51PA
- BCP51-10 SPICE model BCP51-10
- BCP51-16 SPICE model BCP51-16
- BCX51 SPICE model BCX51
- BCX51-10 SPICE model BCX51-10
- BCX51-16 SPICE model BCX51-16
- BCP51_1_2 BCX51-16
- Tape reel SMD; standard product orientation 12NC ending 135 BZV49-C4V3
- plastic surface-mounted package; die pad for good heat transfer; 3 leads BZV49-C9V1
- Tape reel SMD; standard product orientation 12NC ending 115 BZV49-C9V1
- plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55
- Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A
- DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm PMEG6020EPA
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- DFN2020-3; reel pack; standard product orientation; 12NC ending 115 PMEG6020EPA
- BFU590Q
- BLT81
- PTVSXU1UPA_SERIES
