BGA6130: 400 MHz to 2700 MHz 1 W high efficiency silicon amplifier
The MMIC is a one-stage amplifier, offered in a low-cost leadless surface-mount package. At 3.6 V it delivers 29.5 dBm output power at 3 dB gain compression with efficiency higher than 55 %. Its power saving features include simple quiescent current adjustment, which allows class-AB operation and logic-level shutdown control to reduce the supply current to 4 μA.
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 400 MHz to 2700 MHz 1 W high efficiency silicon amplifier (REV 2.0) PDF (737.0 kB) BGA6130 | 12 Feb 2014 |
Users Guides (1)
| Name/Description | Modified Date |
|---|---|
| User Manual for OM7828/BGA6130/Kit (REV 1.0) PDF (119.0 kB) UM10565 | 20 Sep 2012 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic thermal enhanced very thin small outline package; no leads; 8 terminals (REV 1.0) PDF (179.0 kB) SOT908-3 | 08 Feb 2016 |
Ordering Information
| Product | Status | Package version | Package name | frange [min] (MHz) | frange [max] (MHz) | @VCC (V) | ICC [typ] (mA) | ICC [max] (mA) | Gp (dB) | PL(1dB) (dBm) | IP3o (dBm) | NF (dB) | @f (MHz) | IP3O (dBm) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BGA6130 | Active | SOT908-3 | HVSON8 | 400 | 2700 | 3.6 | 70 | 90 | 14 | 29 | 4 | 902 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BGA6130 |  | SOT908-3 | Reel 13" Q1/T1 | Active | BGA6130,118 (9352 948 92118) | Standard Marking | BGA6130 |    | Always Pb-free | 1 | 1 |
