RB521S30: 200 mA low Vf MEGA Schottky barrier rectifier

Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD523 (SC-79) ultra small and flat lead Surface-Mounted Device (SMD) plastic package.

Simplified outline: SOD523 (SC-79)
RB521S30: Block Diagram
sod523_3d
Data Sheets (1)
Name/DescriptionModified Date
200 mA low Vf MEGA Schottky barrier rectifier (REV 1.0) PDF (236.0 kB) RB521S3008 Oct 2009
Selector Guides (1)
Name/DescriptionModified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 7501763117 Feb 2016
Package Information (1)
Name/DescriptionModified Date
plastic surface-mounted package; 2 leads (REV 1.0) PDF (174.0 kB) SOD52308 Feb 2016
Packing (1)
Name/DescriptionModified Date
Tape reel; standard product orientation 12NC ending 115 (REV 1.0) PDF (179.0 kB) SOD523_11507 Nov 2012
Reliability and Quality Information (2)
Name/DescriptionModified Date
RB521S30 NXP Product Quality (REV 1.2) PDF (74.0 kB) RB521S30_NXP_PRODUCT_QUALITY31 Jan 2015
RB521S30 NXP® Product Reliability (REV 1.1) PDF (83.0 kB) RB521S30_NXP_PRODUCT_RELIABILITY31 Jan 2015
Supporting Information (1)
Name/DescriptionModified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE30 Sep 2013
SPICE model
Ordering Information
ProductStatusPackage versionPackage nameSize (mm)IF (A)IR [max] (µA)ConfigurationVF [max] (mV)IFSM [max] (A)Cd [max] (pF)IR [max] (mA)VR [max] (V)IF [max] (mA)VR (V)
RB521S30ActiveSOD523SOD5231.2 x 0.8 x 0.610@VR=10Vsingle500@IF=200mA125@VR=1V0.03@VR=10V30200
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateEFRIFR(FIT)MTBF(hour)MSLMSL LF
RB521S30SOD523Reflow_Soldering_ProfileReel 7" Q1/T1ActiveRB521S30,115 (9340 639 55115)ZBRB521S30Always Pb-free157.00.731.37E911
200 mA low Vf MEGA Schottky barrier rectifier RB521S30
Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
RB521S30 NXP Product Quality RB521S30
RB521S30 NXP® Product Reliability RB521S30
RB521S30 SPICE model RB521S30
plastic surface-mounted package; 2 leads pesd5z7.0
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel; standard product orientation 12NC ending 115 pesd5z7.0
1PSXSB17
BB208-02