SC16IS850LIPW: Single UART with I²C-bus/SPI interface, 128 bytes of transmit and receive FIFOs, IrDA SIR built-in support
The SC16IS850L is a slave I²C-bus/SPI interface to a single-channel high performance UART. It offers data rates up to 5 Mbit/s and guarantees low operating and sleeping current. The device comes in very small HVQFN24 and TSSOP24 packages, which makes it ideally suitable for handheld, battery operated applications. It also enables seamless protocol conversion from I²C-bus or SPI to and RS-232/RS-485 and are fully bidirectional.
The SC16IS850L supports SPI clock speeds up to 12 Mbit/s, and it supports IrDA SIR up to 115.2 kbit/s. Its internal register set is backward-compatible with the widely used and widely popular 16C850. This allows the software to be easily written or ported from another platform.
The SC16IS850L also provides additional advanced features such as auto hardware and software flow control, automatic RS-485 support, and software reset. This allows the software to reset the UART at any moment, independent of the hardware reset signal.
Outline 3d SOT355-1
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| Single UART with I2C-bus/SPI interface, 128 bytes of transmit and receive FIFOs, IrDA SIR built-in support (REV 2.0) PDF (643.0 kB) SC16IS850L | 18 Jul 2012 |
White Papers (1)
| Name/Description | Modified Date |
|---|---|
| What's New in I2C GPIO Devices (REV 1.0) PDF (106.0 kB) WHAT_IS_NEW_IN_I2C_GPIO_DEVICES | 04 Apr 2016 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic thin shrink small outline package; 24 leads; body width 4.4 mm (REV 1.0) PDF (353.0 kB) SOT355-1 | 08 Feb 2016 |
Packing (2)
| Name/Description | Modified Date |
|---|---|
| TSSOP24; Reel pack, SMD, 13" Q4/T2 standard product orientation Orderable part number ending ,128 Ordering... (REV 1.0) PDF (207.0 kB) SOT355-1_128 | 20 Oct 2016 |
| TSSOP24; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or... (REV 4.1) PDF (227.0 kB) SOT355-1_118 | 15 Apr 2013 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Footprint for wave soldering (REV 1.0) PDF (16.0 kB) SSOP-TSSOP-VSO-WAVE | 08 Oct 2009 |
Ordering Information
| Product | Status | Status | Budgetary Price excluding tax(US$) | Package Type and Termination Count | GPIOs | Qualification Tier |
|---|---|---|---|---|---|---|
| SC16IS850LIPW | End of Life |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| SC16IS850LIPW | | SOT355-1 | SSOP-TSSOP-VSO-WAVE | Reel 13" Q1/T1 | Discontinued | SC16IS850LIPW,118 (9352 933 95118) | 16IS850L | SC16IS850LIPW |    | Always Pb-free | 1 | 1 |
