SC18IS602BIPW: I2C-bus to SPI bridge
The SC18IS602B is designed to serve as an interface between a standard I²C-bus of a microcontroller and an SPI bus. This allows the microcontroller to communicate directly with SPI devices through its I²C-bus. The SC18IS602B operates as an I²C-bus slave-transmitter or slave-receiver and an SPI master. The SC18IS602B controls all the SPI bus-specific sequences, protocol, and timing. The SC18IS602B has its own internal oscillator, and it supports four SPI chip select outputs that may be configured as GPIO when not used.
Outline 3d SOT403-1
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| I2C-bus to SPI bridge (REV 5.2) PDF (164.0 kB) SC18IS602B | 26 Oct 2016 |
Brochures (1)
| Name/Description | Modified Date |
|---|---|
| NXP® High-speed UARTs and Bridge ICs (REV 1.0) PDF (5.7 MB) 75017552 | 03 Apr 2014 |
White Papers (1)
| Name/Description | Modified Date |
|---|---|
| What's New in I2C GPIO Devices (REV 1.0) PDF (106.0 kB) WHAT_IS_NEW_IN_I2C_GPIO_DEVICES | 04 Apr 2016 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic thin shrink small outline package; 16 leads; body width 4.4 mm (REV 1.0) PDF (300.0 kB) SOT403-1 | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| TSSOP16; Reel pack; SMD, 13", Turned Q4/T2 180 deg product orientation Orderable part number ending ,128 or HP ... (REV 2.0) PDF (255.0 kB) SOT403-1_128 | 14 Oct 2014 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Footprint for wave soldering (REV 1.0) PDF (16.0 kB) SSOP-TSSOP-VSO-WAVE | 08 Oct 2009 |
Ordering Information
| Product | Status | Status | Budgetary Price excluding tax(US$) | Package Type and Termination Count | GPIOs | Qualification Tier |
|---|---|---|---|---|---|---|
| SC18IS602BIPW | Active |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| SC18IS602BIPW | | SOT403-1 | SSOP-TSSOP-VSO-WAVE | Reel 13" Q2/T3 | Active | SC18IS602BIPW,128 (9352 861 82128) | IS602B | SC18IS602BIPW |    | Always Pb-free | 1 | 1 |
| Bulk Pack | Active | SC18IS602BIPW,112 (9352 861 82112) | IS602B | SC18IS602BIPW | | Always Pb-free | 1 | 1 |
- I2C-bus to SPI bridge sc18is602bipw
- NXP® High-speed UARTs and Bridge ICs SC28L92
- SSOP-TSSOP-VSO-WAVE LPC1114FDH28
- TSSOP16; Reel pack; SMD, 13", Turned Q4/T2 180 deg product orientation Orderable part number ending ,128 or HP ... sc18im700ipw
- Footprint for reflow soldering SOT403-1 PCA9633
- plastic thin shrink small outline package; 16 leads; body width 4.4 mm PCA9633
