UJA1069: LIN fail-safe system basis chip _ BDTIC a Leading Distributor in China

UJA1069: LIN fail-safe system basis chip

The UJA1069 fail-safe System Basis Chip (SBC) replaces basic discrete components which are common in every Electronic Control Unit (ECU) with a Local Interconnect Network (LIN) interface. The fail-safe SBC supports all networking applications which control various power and sensor peripherals by using LIN as a local sub-bus. The fail-safe SBC contains the following integrated devices:

In addition to the advantages of integrating these common ECU functions in a single package, the fail-safe SBC offers an intelligent combination of system-specific functions such as:

The UJA1069 is designed to be used in combination with a microcontroller and a LIN controller. The fail-safe SBC ensures that the microcontroller is always started up in a defined manner. In failure situations the fail-safe SBC will maintain the microcontroller function for as long as possible, to provide full monitoring and software driven fall-back operation.

The UJA1069 is designed for 14 V single power supply architectures and for 14 V and 42 V dual power supply architectures.

sot549-1_3d

General

Contains a full set of LIN ECU functions: LIN transceiver Voltage regulator for the microcontroller (5.0 V) Enhanced window watchdog with on-chip oscillator Serial Peripheral Interface (SPI) for the microcontroller ECU power management system Fully integrated autonomous fail-safe system
Designed for automotive applications: Supports 14 V and 42 V architectures Excellent ElectroMagnetic Compatibility (EMC) performance +-8 kV ElectroStatic Discharge (ESD) protection Human Body Model (HBM) for off-board pins +-4 kV ElectroStatic Discharge (ESD) protection IEC 61000-4-2 for off-board pins +-60 V short-circuit proof LIN-bus pin Battery and LIN-bus pins are protected against transients in accordance with ISO 7637-3 Very low sleep current
Supports remote flash programming via the LIN-bus
Available in: Small 6.4 mm x 7.8 mm HTSSOP24 package with low thermal resistance Small 8 mm x 11 mm HTSSOP32 package with low thermal resistance

LIN transceiver

LIN 2.0 and SAE J2602 compliant LIN transceiver
Enhanced error signalling and reporting
Downward compatible with LIN 1.3 and the TJA1020

Power management

Smart operating modes and power management modes
Cyclic wake-up capability in Standby and Sleep mode
Local wake-up input with cyclic supply feature
Remote wake-up capability via the LIN-bus
External voltage regulators can easily be incorporated in the power supply system (flexible and fail-safe)
42 V battery related high-side switch for driving external loads such as relays and wake-up switches
Intelligent maskable interrupt output

Fail-safe features

Safe and predictable behavior under all conditions
Programmable fail-safe coded window and time-out watchdog with on-chip oscillator, guaranteeing autonomous fail-safe system supervision
Fail-safe coded 16-bit SPI interface for the microcontroller
Global enable pin for the control of safety-critical hardware
Detection and detailed reporting of failures: On-chip oscillator failure and watchdog alerts Battery and voltage regulator undervoltages LIN-bus failures (short-circuits) TXDL and RXDL clamping situations and short-circuits Clamped or open reset line SPI message errors Overtemperature warning
Rigorous error handling based on diagnostics
Supply failure early warning allows critical data to be stored
23 bits of access-protected RAM is available e.g. for logging of cyclic problems
Reporting in a single SPI message; no assembly of multiple SPI frames needed
Limp-home output signal for activating application hardware in case system enters Fail-safe mode (e.g. for switching on warning lights)
Fail-safe coded activation of Software development mode and Flash mode
Unique SPI readable device type identification
Software-initiated system reset

Data Sheets (1)

Name/Description	Modified Date
LIN fail-safe system basis chip (REV 4.0) PDF (293.0 kB) UJA1069	28 Oct 2009

Package Information (2)

Name/Description	Modified Date
plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die... (REV 1.0) PDF (380.0 kB) SOT549-1	08 Feb 2016
plastic thermal enhanced thin shrink small outline package; 24 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die... (REV 1.0) PDF (335.0 kB) SOT864-1	08 Feb 2016

Ordering Information

Product	Status	Category	Product category	Supported standards	Package name	Package version	Low power modes	Supply voltage [min] (V)	Supply voltage [max] (V)	Data rate [min] (kb/s)	Data rate [max] (kb/s)	CAN channels	LIN channels	FlexRay Channels	Voltage on bus pins [min] (V)	Voltage on bus pins [max] (V)	V_ESD IEC61000-4-2 (kV)	V_ESD HBM on bus pins (+/- kV)	VIO option available	T_vj [max] (°C)	SPLIT pin	Under-voltage detection	TX Dominant Time out	Over-temperature detection	INH / Wake Pin	Min High Input Levels (V)	No of pins	Application	Recommended Version
UJA1069TW	No Longer Manufactured	LIN	SBC; LIN Transceiver; Fail-safe SBC	LIN 2.0; SAE J2602; compatible with LIN 1.3	HTSSOP32	SOT549-1	Standby Mode; Sleep Mode	5.5	33	1	20	0	1	0	-60	60	4	8	No	-40~150	No	Yes	Yes	Yes	Yes	0.7 x Vv1	32	Yes	150mA

Package Information

Product ID	Outline Version	Packing	Product Status	Part NumberOrdering code(12NC)	Marking	Chemical Content	LeadFree Conversion Date	MSL	MSL LF
UJA1069TW/5V0/C/T	SOT549-1	Reel 13" Q1/T1 in Drypack	Active	UJA1069TW/5V0/C/T (9352 888 72518)	Standard Marking	UJA1069TW/5V0/C/T	Always Pb-free	3	3
UJA1069TW/5V0/C/T	SOT549-1	Tube in Drypack	Active	UJA1069TW/5V0/C/T, (9352 888 72512)	Standard Marking	UJA1069TW/5V0/C/T	Always Pb-free	3	3
UJA1069TW24/5V0/C	SOT864-1	Reel 13" Q1/T1 in Drypack	Active	UJA1069TW24/5V0/C: (9352 854 13518)	Standard Marking	UJA1069TW24/5V0/C	Always Pb-free	3	3
UJA1069TW24/5V0/C	SOT864-1	Tube in Drypack	Active	UJA1069TW24/5V0/C, (9352 854 13512)	Standard Marking	UJA1069TW24/5V0/C	Always Pb-free	3	3