EMIF08-1005M16:8-line low capacitance EMI filter and ESD protection

The EMIF08-1005M16 is an 8-line, highly integrated device designed to suppress EMI/RFI noise in all systems exposed to electromagnetic interference.

This filter includes an ESD protection circuitry, which prevents damage to the application when subjected to ESD surges up to 15 kV on the input or output pins.

Key Features

  • High reliability offered by monolithic integration
  • High efficiency in ESD suppression on inputs pins (IEC 61000-4-2 level 4)
  • Lead-free package
  • EMI symmetrical (I/O) low-pass filter
  • Cut-off frequency: 100 MHz
  • High efficiency in EMI filtering:Greater than -34 dB attenuation at frequencies from 900 MHz to 1.8 GHz
  • Very thin package: 0.6 mm max.
  • High reduction of parasitic elements through integration
  • Very low PCB space consuming: 3.3 mm x 1.5 mm
Product Specifications
DescriptionVersionSize
DS4994: 8-line IPAD™ low capacitance EMI filter and ESD protection in micro QFN package2.2272 KB
Application Notes
DescriptionVersionSize
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use5.0261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use8.0251 KB
Technical Notes & Articles
DescriptionVersionSize
TA0318: EMI and ESD consideration for LCD and cameras in wireless handsets1.2115 KB
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches4.0330 KB
Sample & Buy
Part NumberPackagePacking TypeUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
EMIF08-1005M16uQFN-16LTape And Reel0.421000NECEAR99CHINA
Quality & Reliability
Part NumberPackageGradeRoHS Compliance GradeMaterial Declaration**
EMIF08-1005M16uQFN-16LIndustrialEcopack2md_vy-wspc-fpn-wspc-3.3x1.5-wspc---wspc-16l_esvy-wspc-emi8t3a.pdf
md_vy-wspc-fpn-wspc-3.xml
8-line IPAD™ low capacitance EMI filter and ESD protection in micro QFN package EMIF08-1005M16
IPAD™ 400 µm Flip Chip: package description and recommendations for use HSP061-4M10
IPAD™ 500 µm Flip Chip: package description and recommendations for use CPL-WBF-00D3
EMI and ESD consideration for LCD and cameras in wireless handsets EMIF08-1005M16
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches FLC21
md_vy-wspc-fpn-wspc-3.3x1.5-wspc---wspc-16l_esvy-wspc-emi8t3a.pdf EMIF08-1005M16
md_vy-wspc-fpn-wspc-3.xml HSP061-8M16