Hybrid Circuit Substrates High-Power Multi-Tiered Conductor Hybrid Circuit Substrate

Features
  • Copper power lines up to 5000 microinches thick
  • Gold small signal lines ± 100 microinches width tolerance
  • Temperatures to 350 °C
Datasheet
Application Notes
  • Application Note - Cost-effective High Volume Interconnect Thin Film Substrate Solutions
General Information
  • General Information - 2009 Review of Thin Film North America Products (Vishay Thin Film, Vishay Electro-Films)
Product Literature
  • Capabilities - AuSn Series - Thin Film Patterned Substrates with Deposited Gold/Tin Pads
  • Capabilities Brochure - Diode Submount Capabilities Using Thin Film Substrates
  • Capabilities Brochure - Pattern Substrates Using Thin Film Technology: Vishay Electro-Films Application-Specific Pattern Substrates
  • Product Sheet - Model HDI: High-Density Interconnects
Reference Data
Technical Notes
  • Technical Note - An Introduction to Substrate PIMIC Technology
  • Technical Note - Applications and Design of Plated and Filled Via Circuits
  • Technical Note - Thin Film High-Density Integration (HDI) Design Guidelines
Hybrid Circuit Substrates 61053
Application Note 61053
General Information 61053
Capabilities 61053
Capabilities Brochure 61053
Capabilities Brochure 61053
Product Sheet 61053
Application Note 61053
Characteristics & Capabilities 61053
Technical Note 61053
Technical Note 61053
Technical Note 61053
Technical Note 61053
HP - MT Conductor Hybrid Circuit Substrates 61053