BLF10M6(LS)200:功率LDMOS晶体管

200 W LDMOS功率晶体管,适合700 MHz至1000 MHz频率范围的ISM应用。

特性和优势
    • 方便的功率控制
    • 集成ESD保护
    • 极佳的强度
    • 高效率
    • 极佳的热稳定性
    • 设计用于宽带操作(700 MHz至1000 MHz)
    • 内部匹配,便于使用
    • 符合欧盟2002/95/EC危害性物质限制(RoHS)指令
应用
    • 适合700 MHz至1000 MHz频率范围内ISM应用的RF功率放大器
产品图片
关键参数
型号Package versionfrange [min] (MHz)frange [max] (MHz)PL(1dB) (W)VDS (V)η (%)GP (dB)Test signalProduct status
BLF10M6200SOT502A70010002002828.5202-c WCDMA; 2-c WCDMAProduction
BLF10M6LS200SOT502B70010002002828.5202-c WCDMA; 2-c WCDMAProduction
封装与包装
型号封装Outline versionReflow-/Wave soldering包装产品状态标示可订购的器件编号, (订购码 (12NC))
BLF10M6200

(SOT502A)
sot502a_poBulk Pack量产Standard MarkingBLF10M6200U( 9340 677 78112 )
BLF10M6LS200

(SOT502B)
sot502b_poBulk Pack量产Standard MarkingBLF10M6LS200U( 9340 677 79112 )
无铅环保信息
型号可订购的器件编号RoHS / RHF无铅转换日期潮湿敏感度等级MSL LF
BLF10M6200BLF10M6200UAlways Pb-freeNA
BLF10M6LS200BLF10M6LS200UAlways Pb-freeNA
文档资料
档案名称标题类型格式日期
BLF10M6200_BLF10M6LS200 (中文)Power LDMOS transistorData sheetpdf2013-07-26
AN10896Mounting and Soldering of RF transistorsApplication notepdf2015-03-24
fatigue_in_aluminum_bond_wiresFatigue in aluminum bond wiresMounting and solderingpdf2009-10-08
NXP_RF_manual_19th_editionRF Manual 19th edition: Application and design manual for High Performance RF products May 2015Other typepdf2015-05-19
sot502b_poearless flanged ceramic package; 2 leadsOutline drawingpdf2007-05-08
SOT502B_112CDFM2; blister pack; standard product orientation 12NC ending 112Packingpdf2012-12-03
sot502a_poflanged ceramic package; 2 mounting holes; 2 leadsOutline drawingpdf2009-10-08
SOT502A_112CDFM2; blister pack; standard product orientation 12NC ending 112Packingpdf2012-11-30
SOT502A_135Tape reel SMD; standard product orientation 12NC ending 135Packingpdf2012-12-03
订购信息
型号订购码 (12NC)可订购的器件编号
BLF10M62009340 677 78112BLF10M6200U
BLF10M6LS2009340 677 79112BLF10M6LS200U
Power LDMOS transistor BLF10M6_LS_200
Power LDMOS transistor BLF10M6_LS_200
Power LDMOS transistor BLF10M6_LS_200
Mounting and Soldering of RF transistors aerospace_defense
Fatigue in aluminum bond wires gan_devices
RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 rf
earless flanged ceramic package; 2 leads BLS7G3135LS-200
CDFM2; blister pack; standard product orientation 12NC ending 112 BLS7G3135LS-200
flanged ceramic package; 2 mounting holes; 2 leads BLS7G2325L-105
CDFM2; blister pack; standard product orientation 12NC ending 112 BLS7G2325L-105
Tape reel SMD; standard product orientation 12NC ending 135 BLS6G3135_S_120