BLF574XR(S):功率LDMOS晶体管

为600 W极耐用LDMOS功率晶体管,适用于HF至500 MHz频段广播和工业应用。本产品是BLF574(使用恩智浦的XR工艺)的增强版本,在大多数严酷应用中提供最大的耐用能力而不会降低RF性能。

特性和优势
    • 方便的功率控制
    • 集成ESD保护
    • 极佳的强度
    • 高效率
    • 极佳的热稳定性
    • 主要用于宽带操作(HF至500 MHz)
    • 符合有害物质限制的Directive 2002/95/EC
应用
    • 工业、科学和医疗应用
    • 广播发射器应用
产品图片
关键参数
型号Package versionfrange [min] (MHz)frange [max] (MHz)PL(1dB) (W)VDS (V)η (%)GP (dB)Test signalProduct status
BLF574XRSOT1214A105006005074.724Pulsed RF; Pulsed RFProduction
BLF574XRSSOT1214B105006005074.724Pulsed RF; Pulsed RFProduction
封装与包装
型号封装Outline versionReflow-/Wave soldering包装产品状态标示可订购的器件编号, (订购码 (12NC))
BLF574XR

(SOT1214A)
sot1214a_poBulk Pack量产Standard MarkingBLF574XR,112( 9340 670 86112 )
BLF574XRS

(SOT1214B)
sot1214b_poBulk Pack量产Standard MarkingBLF574XRS,112( 9340 670 87112 )
无铅环保信息
型号可订购的器件编号RoHS / RHF无铅转换日期潮湿敏感度等级MSL LF
BLF574XRBLF574XR,112Always Pb-free
BLF574XRSBLF574XRS,112Always Pb-free
文档资料
档案名称标题类型格式日期
BLF574XR_BLF574XRS (中文)Power LDMOS transistorData sheetpdf2013-06-20
AN10896Mounting and Soldering of RF transistorsApplication notepdf2015-03-24
AN11287Lifetime of BLF574XR in broadcast and ISM applicationsApplication notepdf2013-05-28
PCB_Design_BLF574XR_BLF574XRS_Data-sheetPCB Design BLF574XR(S) (Data sheet)Design supportzip2013-06-25
fatigue_in_aluminum_bond_wiresFatigue in aluminum bond wiresMounting and solderingpdf2009-10-08
NXP_RF_manual_19th_editionRF Manual 19th edition: Application and design manual for High Performance RF products May 2015Other typepdf2015-05-19
NXP_RFpower_Lib_V09p0RF Power Model Library for Microwave Office®Simulation modelzip2014-11-11
NXP_RFpower_Manual_MWO_20141111RF Power Model Library Manual and Installation Instructions for Microwave Office®Simulation modelpdf2014-11-11
NXP_RFPower_Simulation_ExampleRF Power Simulation Example for Microwave Office®Simulation modelzip2012-06-11
BLF574XR_ADS-2009_ModelBLF574XR ADS-2009 ModelSimulation modelzip2013-06-20
BLF574XR_ADS-2011_ModelBLF574XR ADS-2011 ModelSimulation modelzip2014-04-10
sot1214b_poEarless flanged ceramic package; 4 leadsOutline drawingpdf2014-03-27
sot1214a_poflanged ceramic package; 2 mounting holes; 4 leadsOutline drawingpdf2012-10-10
订购信息
型号订购码 (12NC)可订购的器件编号
BLF574XR9340 670 86112BLF574XR,112
BLF574XRS9340 670 87112BLF574XRS,112
模型
标题类型日期
RF Power Model Library for Microwave Office®Simulation model2014-11-11
RF Power Model Library Manual and Installation Instructions for Microwave Office®Simulation model2014-11-11
RF Power Simulation Example for Microwave Office®Simulation model2012-06-11
BLF574XR ADS-2009 ModelSimulation model2013-06-20
BLF574XR ADS-2011 ModelSimulation model2014-04-10
其它
标题类型日期
PCB Design BLF574XR(S) (Data sheet)Design support2013-06-25
Power LDMOS transistor BLF574XR_S
Power LDMOS transistor BLF574XR_S
Power LDMOS transistor BLF574XR_S
Mounting and Soldering of RF transistors aerospace_defense
Lifetime of BLF574XR in broadcast and ISM applications BLF574XR_S
Fatigue in aluminum bond wires gan_devices
RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 rf
Earless flanged ceramic package; 4 leads BLF574XR_S
flanged ceramic package; 2 mounting holes; 4 leads BLF574XR_S
RF Power Model Library for Microwave Office® CLF1G0060_S_30
RF Power Model Library Manual and Installation Instructions for Microwave Office® CLF1G0060_S_30
RF Power Simulation Example for Microwave Office® CLF1G0060_S_30
BLF574XR ADS-2009 Model BLF574XR_S
BLF574XR ADS-2011 Model BLF574XR_S
PCB Design BLF574XR(S) (Data sheet) BLF574XR_S