BLF7G22L(S)-160:功率LDMOS晶体管

160 W LDMOS功率晶体管,适用于2000 MHz至2200 MHz频率范围的基站应用。

特性和优势
    • 极佳的强度
    • 低Rth提供极佳的热稳定性
    • 高效率
    • 内部匹配以方便使用
    • 集成ESD保护
    • 主要用于降低记忆效应以提供极佳预失真能力
    • 符合有害物质限制的Directive 2002/95/EC
应用
    • W-CDMA基站RF功率放大器
    • 2000 MHz 至2200 MHz频率范围内的多载波应用
产品图片
关键参数
型号Package versionfrange [min] (MHz)frange [max] (MHz)PL(1dB) (W)VDS (V)η (%)GP (dB)Test signalProduct status
BLF7G22LS-160SOT502B200022001602830182-c WCDMA; 2-c WCDMAProduction
封装与包装
型号封装Outline versionReflow-/Wave soldering包装产品状态标示可订购的器件编号, (订购码 (12NC))
BLF7G22LS-160

(SOT502B)
sot502b_poReel 13" Q1/T1量产Standard MarkingBLF7G22LS-160,118( 9340 652 32118 )
Bulk Pack量产Standard MarkingBLF7G22LS-160,112( 9340 652 32112 )
无铅环保信息
型号可订购的器件编号RoHS / RHF无铅转换日期潮湿敏感度等级MSL LF
BLF7G22LS-160BLF7G22LS-160,118Always Pb-freeNANA
BLF7G22LS-160BLF7G22LS-160,112Always Pb-freeNANA
文档资料
档案名称标题类型格式日期
BLF7G22L-160_7G22LS-160 (中文)Power LDMOS transistorData sheetpdf2011-11-02
AN10896Mounting and Soldering of RF transistorsApplication notepdf2015-03-24
75017347Enabling the Mobile ExperienceBrochurepdf2013-02-05
fatigue_in_aluminum_bond_wiresFatigue in aluminum bond wiresMounting and solderingpdf2009-10-08
NXP_RF_manual_19th_editionRF Manual 19th edition: Application and design manual for High Performance RF products May 2015Other typepdf2015-05-19
BLF7G22L-160_ADS-2009_ModelBLF7G22L-160 ADS-2009 ModelSimulation modelzip2013-02-28
BLF7G22L-160_ADS-2011_ModelBLF7G22L-160 ADS-2011 ModelSimulation modelzip2014-04-11
sot502b_poearless flanged ceramic package; 2 leadsOutline drawingpdf2007-05-08
SOT502B_112CDFM2; blister pack; standard product orientation 12NC ending 112Packingpdf2012-12-03
订购信息
型号订购码 (12NC)可订购的器件编号
BLF7G22LS-1609340 652 32118BLF7G22LS-160,118
BLF7G22LS-1609340 652 32112BLF7G22LS-160,112
模型
标题类型日期
BLF7G22L-160 ADS-2009 ModelSimulation model2013-02-28
BLF7G22L-160 ADS-2011 ModelSimulation model2014-04-11
Power LDMOS transistor BLF7G22L_S_160
Power LDMOS transistor BLF7G22L_S_160
Power LDMOS transistor BLF7G22L_S_160
Mounting and Soldering of RF transistors aerospace_defense
Enabling the Mobile Experience rf
Fatigue in aluminum bond wires gan_devices
RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 rf
earless flanged ceramic package; 2 leads BLS7G3135LS-200
CDFM2; blister pack; standard product orientation 12NC ending 112 BLS7G3135LS-200
BLF7G22L-160 ADS-2009 Model BLF7G22L_S_160
BLF7G22L-160 ADS-2011 Model BLF7G22L_S_160