BLM7G1822S-40AB(G):LDMOS 2-stage power MMIC

The BLM7G1822S-40AB(G) is a dual section, asymmetric, 2-stage power MMIC using NXP’s state of the art GEN7 LDMOS technology. This multiband device is perfectly suited as small cell final in Doherty configuration, or as general purpose driver in the 1805 MHz to 2170 MHz frequency range. Available in gull wing or straight lead outline.

特性和优势
    • Designed for broadband operation (frequency 1805 MHz to 2170 MHz)
    • High section-to-section isolation enabling multiple combinations
    • High Doherty efficiency thanks to 2 : 1 asymmetry
    • Integrated temperature compensated bias
    • Biasing of individual stages is externally accessible
    • Integrated ESD protection
    • Excellent thermal stability
    • High power gain
    • On-chip matching for ease of use
    • Compliant to Directive 2002/95/EC, regarding restriction of hazardous substances (RoHS)
应用
    • RF power MMIC for W-CDMA base stations in the 1805 MHz to 2170 MHz frequency range. Possible circuit topologies are the following:
      • Asymmetric final stage in Doherty configuration
      • Asymmetric driver for high power Doherty amplifier
    • Asymmetric final stage in Doherty configuration
    • Asymmetric driver for high power Doherty amplifier
产品图片
关键参数
型号Package versionfrange [min] (MHz)frange [max] (MHz)PL(1dB) (W)VDS (V)η (%)GP (dB)Test signalProduct status
BLM7G1822S-40ABSOT1211-218052170402826.531.81-c WCDMA; 1-c WCDMAProduction
BLM7G1822S-40ABGSOT1212-218052170402826.531.81-c WCDMA; 1-c WCDMAProduction
封装与包装
型号封装Outline versionReflow-/Wave soldering包装产品状态标示可订购的器件编号, (订购码 (12NC))
BLM7G1822S-40AB
HSOP16F
(SOT1211-2)
sot1211-2_poReel 13" Q1/T1 in Drypack量产Standard MarkingBLM7G1822S-40ABY( 9340 688 95518 )
BLM7G1822S-40ABG
HSOP16
(SOT1212-2)
sot1212-2_poReel 13" Q1/T1 in Drypack量产Standard MarkingBLM7G1822S-40ABGY( 9340 688 96518 )
无铅环保信息
型号可订购的器件编号RoHS / RHF无铅转换日期潮湿敏感度等级MSL LF
BLM7G1822S-40ABBLM7G1822S-40ABY33
BLM7G1822S-40ABGBLM7G1822S-40ABGY33
文档资料
档案名称标题类型格式日期
BLM7G1822S-40AB_S-40ABG (中文)LDMOS 2-stage power MMICData sheetpdf2015-07-10
AN11183Mounting and soldering of RF transistors in over-molded plastic packagesApplication notepdf2012-11-06
75017347Enabling the Mobile ExperienceBrochurepdf2013-02-05
PCB_Design_BLM7G1822S-40AB_S-40ABG_Data-sheetPCB Design BLM7G1822S-40AB(G) (Data sheet)Design supportzip2015-07-20
fatigue_in_aluminum_bond_wiresFatigue in aluminum bond wiresMounting and solderingpdf2009-10-08
NXP_RF_manual_19th_editionRF Manual 19th edition: Application and design manual for High Performance RF products May 2015Other typepdf2015-05-19
sot1212-2_poplastic, heatsink small outline package; 16 leadsOutline drawingpdf2015-01-12
sot1211-2_poplastic, heatsink small outline package; 16 leads(flat)Outline drawingpdf2015-01-13
订购信息
型号订购码 (12NC)可订购的器件编号
BLM7G1822S-40AB9340 688 95518BLM7G1822S-40ABY
BLM7G1822S-40ABG9340 688 96518BLM7G1822S-40ABGY
其它
标题类型日期
PCB Design BLM7G1822S-40AB(G) (Data sheet)Design support2015-07-20
LDMOS 2-stage power MMIC BLM7G1822S_40AB_G
Mounting and soldering of RF transistors in over-molded plastic packages BLP8G21S-160PV
Enabling the Mobile Experience rf
Fatigue in aluminum bond wires gan_devices
RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 rf
plastic, heatsink small outline package; 16 leads BLM7G1822S_40AB_G
plastic, heatsink small outline package; 16 leads(flat) BLM7G1822S_40AB_G
PCB Design BLM7G1822S-40AB(G) (Data sheet) BLM7G1822S_40AB_G