BLM7G22S-60PB(G):LDMOS 2级功率MMIC

BLM7G22S-60PB(G) 是一款双路径2级MMIC,使用恩智浦先进的GEN7 LDMOS技术。此器件完美适合用作2100 MHz至2200 MHz频率范围内的通用驱动器。提供鸥翼或扁平引脚外形。

特性和优势
    • 集成温度补偿偏置
    • 可外部访问不同级的偏置
    • 集成电流感应
    • 集成ESD保护
    • 极佳的热稳定性
    • 高功率增益
    • 片上匹配以方便使用(输入匹配到50 Ω)
    • 主要用于宽带操作(2100 MHz至2200 MHz)
    • 符合RoHS的Directive 2002/95/EC
应用
    • W-CDMA基站2100 MHz - 2200 MHz RF功率MMIC
产品图片
关键参数
型号Package versionfrange [min] (MHz)frange [max] (MHz)PL(1dB) (W)VDS (V)η (%)GP (dB)Test signalProduct status
BLM7G22S-60PBSOT1211-121002200602811.331.52-c WCDMA; 2-c WCDMAProduction
BLM7G22S-60PBGSOT1212-121002200602811.331.52-c WCDMA; 2-c WCDMAProduction
封装与包装
型号封装Outline versionReflow-/Wave soldering包装产品状态标示可订购的器件编号, (订购码 (12NC))
BLM7G22S-60PB
HSOP16F
(SOT1211-1)
sot1211-1_poReel 13" Q1/T1 in Drypack量产Standard MarkingBLM7G22S-60PBY( 9340 660 82518 )
BLM7G22S-60PBG
HSOP16
(SOT1212-1)
sot1212-1_poReel 13" Q1/T1 in Drypack量产Standard MarkingBLM7G22S-60PBGY( 9340 660 83518 )
停产信息
型号订购码 (12NC)最后一次购买日期最后一次交货日期替代产品
BLM7G22S-60PB934066082118
BLM7G22S-60PBG934066083118
无铅环保信息
型号可订购的器件编号RoHS / RHF无铅转换日期潮湿敏感度等级MSL LF
BLM7G22S-60PBBLM7G22S-60PBY33
BLM7G22S-60PBGBLM7G22S-60PBGY33
文档资料
档案名称标题类型格式日期
BLM7G22S-60PB_7G22S-60PBG (中文)LDMOS 2-stage power MMICData sheetpdf2015-07-01
AN11183Mounting and soldering of RF transistors in over-molded plastic packagesApplication notepdf2012-11-06
75017347Enabling the Mobile ExperienceBrochurepdf2013-02-05
PCB_Design_BLM7G22S-60PB_7G22S-60PBG_Data-sheetPCB Design BLM7G22S-60PB(G) (Data sheet)Design supportzip2012-12-13
fatigue_in_aluminum_bond_wiresFatigue in aluminum bond wiresMounting and solderingpdf2009-10-08
NXP_RF_manual_19th_editionRF Manual 19th edition: Application and design manual for High Performance RF products May 2015Other typepdf2015-05-19
BLM7G22S-60PBG_ADS-2009_ModelBLM7G22S-60PBG ADS-2009 ModelSimulation modelzip2013-08-01
sot1212-1_poplastic, heatsink small outline package; 16 leads(flat)Outline drawingpdf2012-04-17
sot1211-1_poplastic, heatsink small outline package; 16 leads(flat)Outline drawingpdf2013-06-25
订购信息
型号订购码 (12NC)可订购的器件编号
BLM7G22S-60PB9340 660 82518BLM7G22S-60PBY
BLM7G22S-60PBG9340 660 83518BLM7G22S-60PBGY
模型
标题类型日期
BLM7G22S-60PBG ADS-2009 ModelSimulation model2013-08-01
其它
标题类型日期
PCB Design BLM7G22S-60PB(G) (Data sheet)Design support2012-12-13
LDMOS 2-stage power MMIC BLM7G22S_60PB_G
LDMOS 2-stage power MMIC BLM7G22S_60PB_G
LDMOS 2-stage power MMIC BLM7G22S_60PB_G
Mounting and soldering of RF transistors in over-molded plastic packages BLP8G21S-160PV
Enabling the Mobile Experience rf
Fatigue in aluminum bond wires gan_devices
RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 rf
plastic, heatsink small outline package; 16 leads(flat) BLM8G0710S-45ABG
plastic, heatsink small outline package; 16 leads(flat) BLM8G0710S-45AB
BLM7G22S-60PBG ADS-2009 Model BLM7G22S_60PB_G
PCB Design BLM7G22S-60PB(G) (Data sheet) BLM7G22S_60PB_G