BLM8G0710S-30PB(G)：LDMOS 2-stage power MMIC
The BLM8G0710S-30PB(G) is a dual section, 2-stage power MMIC using NXP’s state of the art GEN8 LDMOS technology. This multiband device is perfectly suited as general purpose driver or small cell final in the frequency range from 700 MHz to 1000 MHz. Available in gull wing or straight lead outline.
特性和优势
应用
| 产品图片  |
关键参数
| 型号 | Package version | frange [min] (MHz) | frange [max] (MHz) | PL(1dB) (W) | VDS (V) | η (%) | GP (dB) | Test signal | Product status |
|---|---|---|---|---|---|---|---|---|---|
| BLM8G0710S-30PB | SOT1211-1 | 700 | 1000 | 30 | 28 | 27 | 35.7 | 1-c WCDMA; 1-c WCDMA | Production |
| BLM8G0710S-30PBG | SOT1212-1 | 700 | 1000 | 30 | 28 | 27 | 35.7 | 1-c WCDMA; 1-c WCDMA | Production |
封装与包装
| 型号 | 封装 | Outline version | Reflow-/Wave soldering | 包装 | 产品状态 | 标示 | 可订购的器件编号, (订购码 (12NC)) |
|---|---|---|---|---|---|---|---|
| BLM8G0710S-30PB |  HSOP16F (SOT1211-1) | sot1211-1_po | Reel 13" Q1/T1 in Drypack | 量产 | Standard Marking | BLM8G0710S-30PBY( 9340 688 92518 ) | |
| BLM8G0710S-30PBG |  HSOP16 (SOT1212-1) | sot1212-1_po | Reel 13" Q1/T1 in Drypack | 量产 | Standard Marking | BLM8G0710S-30PBGY( 9340 688 93518 ) |
无铅环保信息
| 型号 | 可订购的器件编号 | RoHS / RHF | 无铅转换日期 | 潮湿敏感度等级 | MSL LF |
|---|---|---|---|---|---|
| BLM8G0710S-30PB | BLM8G0710S-30PBY |   | 3 | 3 | |
| BLM8G0710S-30PBG | BLM8G0710S-30PBGY | | 3 | 3 |
文档资料
| 档案名称 | 标题 | 类型 | 格式 | 日期 |
|---|---|---|---|---|
| BLM8G0710S-30PB_S-30PBG (中文) | LDMOS 2-stage power MMIC | Data sheet | 2015-07-01 | |
| AN11183 | Mounting and soldering of RF transistors in over-molded plastic packages | Application note | 2012-11-06 | |
| 75017347 | Enabling the Mobile Experience | Brochure | 2013-02-05 | |
| PCB_Design_BLM8G0710S-30PB_S-30PBG_Data-sheet | PCB Design BLM8G0710S-30PB(G) (Data sheet) | Design support | zip | 2015-01-30 |
| 75017604 | Gen8: the latest LDMOS RF power portfolio for wireless infrastructures | Leaflet | 2014-09-04 | |
| fatigue_in_aluminum_bond_wires | Fatigue in aluminum bond wires | Mounting and soldering | 2009-10-08 | |
| NXP_RF_manual_19th_edition | RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 | Other type | 2015-05-19 | |
| BLM8G0710S-30PB_ADS-2012_Model | BLM8G0710S-30PB ADS-2012 Model | Simulation model | zip | 2015-01-30 |
| BLM8G0710S-30PBG_ADS-2012_Model | BLM8G0710S-30PBG ADS-2012 Model | Simulation model | zip | 2015-01-30 |
| sot1212-1_po | plastic, heatsink small outline package; 16 leads(flat) | Outline drawing | 2012-04-17 | |
| sot1211-1_po | plastic, heatsink small outline package; 16 leads(flat) | Outline drawing | 2013-06-25 |
订购信息
| 型号 | 订购码 (12NC) | 可订购的器件编号 |
|---|---|---|
| BLM8G0710S-30PB | 9340 688 92518 | BLM8G0710S-30PBY |
| BLM8G0710S-30PBG | 9340 688 93518 | BLM8G0710S-30PBGY |
模型
| 标题 | 类型 | 日期 |
|---|---|---|
| BLM8G0710S-30PB ADS-2012 Model | Simulation model | 2015-01-30 |
| BLM8G0710S-30PBG ADS-2012 Model | Simulation model | 2015-01-30 |
其它
| 标题 | 类型 | 日期 |
|---|---|---|
| PCB Design BLM8G0710S-30PB(G) (Data sheet) | Design support | 2015-01-30 |
- LDMOS 2-stage power MMIC BLM8G0710S_30PB_G
- Mounting and soldering of RF transistors in over-molded plastic packages BLP8G21S-160PV
- Enabling the Mobile Experience rf
- Gen8: the latest LDMOS RF power portfolio for wireless infrastructures base_stations
- Fatigue in aluminum bond wires gan_devices
- RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 rf
- plastic, heatsink small outline package; 16 leads(flat) BLM8G0710S-45ABG
- plastic, heatsink small outline package; 16 leads(flat) BLM8G0710S-45AB
- BLM8G0710S-30PB ADS-2012 Model BLM8G0710S_30PB_G
- BLM8G0710S-30PBG ADS-2012 Model BLM8G0710S_30PB_G
- PCB Design BLM8G0710S-30PB(G) (Data sheet) BLM8G0710S_30PB_G
