型号Status封装包装数量最小独立包装数量包装形态RoHS数据手册
QS8F2TRInActiveTSMT83000100TapingYesQS8F2
技术特性
GradeStandard
Package CodeTSMT8
Package Size[mm]3.0x2.8(t=0.8)
Number of terminal8
PolarityPch+Pch
Drain-Source Voltage VDSS[V]-12
Drain Current ID[A]-2.5
RDS(on)[Ω] VGS=1.5V (Typ.)0.11
RDS(on)[Ω] VGS=2.5V (Typ.)0.06
RDS(on)[Ω] VGS=Drive (Typ.)0.11
Power Dissipation (PD)[W]1.5
Drive Voltage[V]1.5
Mounting StyleSurface mount
Storage Temperature (Min.)[°C]-55
Storage Temperature (Max.)[°C]150
技术支持资料下载
产品特点
  • Low on-resistance.
  • High power package(TSMT8).
  • Low voltage drive(1.5V drive).
QS8F2TR - QS8F2 QS8F2
Spice Model (lib) QS8F2
Thermal Model (lib) QS8F2
Package Information VT6M1
Part Explanation VT6M1
Taping Specifications VT6M1
Condition Of Soldering VT6M1
Storage Conditions VT6M1
Reliability Information RQ1E070RP
Operation Notes VT6M1
Operation Notes VT6M1
NE Handbook Series ZDX100N60