SN74AUP1G57 低功耗可配置多功能门

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static and dynamic power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity, which produces very low undershoot and overshoot characteristics.

The SN74AUP1G57 features configurable multiple functions. The output state is determined by eight patterns of 3-bit input. The user can choose the logic functions AND, OR, NAND, NOR, XNOR, inverter, and noninverter. All inputs can be connected to VCC or GND.

The device functions as an independent gate with Schmitt-trigger inputs, which allow for slow input transition and better switching noise immunity at the input

SN74AUP1G57
tpd max(ns) 5.3  
Pin/Package 6DSBGA, 6SC70, 6SON, 6SOT, 6SOT-23  
IOH(mA) -4  
IOL(mA) -4  
Vcc min(V) 0.8  
Vcc max(V) 3.6  
Performance Optimized  
Approx. Price (US$) 0.17 | 1ku  
Operating Temperature Range(°C) -40 to 85  
Technology Family AUP  
ICC(uA) 0.5  
Rating Catalog
SN74AUP1G57 特性
SN74AUP1G57 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
SN74AUP1G57DBVR ACTIVE -40 to 85 0.17 | 1ku SOT-23 (DBV) | 6 3000 | LARGE T&R  
SN74AUP1G57DBVRE4 ACTIVE -40 to 85 0.17 | 1ku SOT-23 (DBV) | 6 3000 | LARGE T&R  
SN74AUP1G57DBVRG4 ACTIVE -40 to 85 0.17 | 1ku SOT-23 (DBV) | 6 3000 | LARGE T&R  
SN74AUP1G57DBVT ACTIVE -40 to 85 0.50 | 1ku SOT-23 (DBV) | 6 250 | SMALL T&R  
SN74AUP1G57DBVTE4 ACTIVE -40 to 85 0.50 | 1ku SOT-23 (DBV) | 6 250 | SMALL T&R  
SN74AUP1G57DBVTG4 ACTIVE -40 to 85 0.50 | 1ku SOT-23 (DBV) | 6 250 | SMALL T&R  
SN74AUP1G57DCKR ACTIVE -40 to 85 0.17 | 1ku SC70 (DCK) | 6 3000 | LARGE T&R  
SN74AUP1G57DCKRE4 ACTIVE -40 to 85 0.17 | 1ku SC70 (DCK) | 6 3000 | LARGE T&R  
SN74AUP1G57DCKRG4 ACTIVE -40 to 85 0.17 | 1ku SC70 (DCK) | 6 3000 | LARGE T&R  
SN74AUP1G57DCKT ACTIVE -40 to 85 0.50 | 1ku SC70 (DCK) | 6 250 | SMALL T&R  
SN74AUP1G57DCKTE4 ACTIVE -40 to 85 0.50 | 1ku SC70 (DCK) | 6 250 | SMALL T&R  
SN74AUP1G57DCKTG4 ACTIVE -40 to 85 0.50 | 1ku SC70 (DCK) | 6 250 | SMALL T&R  
SN74AUP1G57DRLR ACTIVE -40 to 85 0.21 | 1ku SOT (DRL) | 6 4000 | LARGE T&R  
SN74AUP1G57DRLRG4 ACTIVE -40 to 85 0.21 | 1ku SOT (DRL) | 6 4000 | LARGE T&R  
SN74AUP1G57DRYR ACTIVE -40 to 85 0.20 | 1ku SON (DRY) | 6 5000 | LARGE T&R  
SN74AUP1G57DSFR ACTIVE -40 to 85 0.19 | 1ku SON (DSF) | 6 5000 | LARGE T&R  
SN74AUP1G57YFPR ACTIVE   0.28 | 1ku DSBGA (YFP) | 6 3000 | LARGE T&R  
SN74AUP1G57YZPR ACTIVE -40 to 85 0.30 | 1ku DSBGA (YZP) | 6 3000 | LARGE T&R  
SN74AUP1G57 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
SN74AUP1G57DBVR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1G57DBVR SN74AUP1G57DBVR
SN74AUP1G57DBVRE4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1G57DBVRE4 SN74AUP1G57DBVRE4
SN74AUP1G57DBVRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1G57DBVRG4 SN74AUP1G57DBVRG4
SN74AUP1G57DBVT Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1G57DBVT SN74AUP1G57DBVT
SN74AUP1G57DBVTE4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1G57DBVTE4 SN74AUP1G57DBVTE4
SN74AUP1G57DBVTG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1G57DBVTG4 SN74AUP1G57DBVTG4
SN74AUP1G57DCKR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1G57DCKR SN74AUP1G57DCKR
SN74AUP1G57DCKRE4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1G57DCKRE4 SN74AUP1G57DCKRE4
SN74AUP1G57DCKRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1G57DCKRG4 SN74AUP1G57DCKRG4
SN74AUP1G57DCKT Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1G57DCKT SN74AUP1G57DCKT
SN74AUP1G57DCKTE4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1G57DCKTE4 SN74AUP1G57DCKTE4
SN74AUP1G57DCKTG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1G57DCKTG4 SN74AUP1G57DCKTG4
SN74AUP1G57DRLR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1G57DRLR SN74AUP1G57DRLR
SN74AUP1G57DRLRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1G57DRLRG4 SN74AUP1G57DRLRG4
SN74AUP1G57DRYR Green (RoHS & no Sb/Br)  NIPDAU  Level-1-260C-UNLIM SN74AUP1G57DRYR SN74AUP1G57DRYR
SN74AUP1G57DSFR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1G57DSFR SN74AUP1G57DSFR
SN74AUP1G57YFPR Green (RoHS & no Sb/Br)  SNAGCU  Level-1-260C-UNLIM SN74AUP1G57YFPR SN74AUP1G57YFPR
SN74AUP1G57YZPR Green (RoHS & no Sb/Br)  SNAGCU  Level-1-260C-UNLIM SN74AUP1G57YZPR SN74AUP1G57YZPR
SN74AUP1G57 应用技术支持与电子电路设计开发资源下载
  1. SN74AUP1G57 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器小尺寸逻辑器件产品选型与价格 . xls
  3. Logic Guide 2009 (PDF 4263 KB)
  4. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
  5. Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
  6. TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
  7. Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
  8. CMOS Power Consumption and CPD Calculation (PDF 89 KB)
  9. Designing With Logic (PDF 186 KB)
  10. Live Insertion (PDF 150 KB)
  11. Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
  12. Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
  13. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  14. LOGIC Pocket Data Book (PDF 6001 KB)
  15. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  16. Logic Cross-Reference (PDF 2938 KB)