SN74AUP3G06 低功耗三路反向器闸

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).

The SN74AUP3G06 performs the Boolean function Y = A in positive logic.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down

SN74AUP3G06
Pin/Package 8DSBGA, 8UQFN, 8US8, 8X2SON  
Operating Temperature Range(°C) -40 to 85  
IOL(mA) 4  
IOH(mA) -4  
Vcc max(V) 3.6  
Technology Family AUP  
Vcc min(V) 0.8  
Approx. Price (US$) 0.23 | 1ku  
No. of Gates 3  
tpd max(ns) 4.3  
ICC(uA) 0.9  
Rating Catalog
SN74AUP3G06 特性
SN74AUP3G06 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
SN74AUP3G06DCUR ACTIVE -40 to 85 0.24 | 1ku US8 (DCU) | 8 3000 | LARGE T&R  
SN74AUP3G06DQER ACTIVE -40 to 85 0.23 | 1ku X2SON (DQE) | 8 5000 | LARGE T&R  
SN74AUP3G06RSER ACTIVE -40 to 85 0.24 | 1ku UQFN (RSE) | 8 5000 | LARGE T&R  
SN74AUP3G06YFPR ACTIVE -40 to 85 0.33 | 1ku DSBGA (YZD) | 8 3000 | LARGE T&R  
SN74AUP3G06 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
SN74AUP3G06DCUR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP3G06DCUR SN74AUP3G06DCUR
SN74AUP3G06DQER Green (RoHS & no Sb/Br)  NIPDAU  Level-1-260C-UNLIM SN74AUP3G06DQER SN74AUP3G06DQER
SN74AUP3G06RSER Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP3G06RSER SN74AUP3G06RSER
SN74AUP3G06YFPR Green (RoHS & no Sb/Br)  SNAGCU  Level-1-260C-UNLIM SN74AUP3G06YFPR SN74AUP3G06YFPR
SN74AUP3G06 应用技术支持与电子电路设计开发资源下载
  1. TI 德州仪器小尺寸逻辑器件产品选型与价格 . xls
  2. Logic Guide 2009 (PDF 4263 KB)
  3. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
  4. Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
  5. TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
  6. Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
  7. CMOS Power Consumption and CPD Calculation (PDF 89 KB)
  8. Designing With Logic (PDF 186 KB)
  9. Live Insertion (PDF 150 KB)
  10. Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
  11. Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
  12. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  13. LOGIC Pocket Data Book (PDF 6001 KB)
  14. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  15. Logic Cross-Reference (PDF 2938 KB)