SN74LVC1G175 具有异步清零功能的单路 D 类触发器

This single D-type flip-flop is designed for 1.65-V to 5.5-V VCC operation.

The SN74LVC1G175 has an asynchronous clear (CLR) input. When CLR is high, data from the input pin (D) is transferred to the output pin (Q) on the clock's (CLK) rising edge. When CLR is low, Q is forced into the low state, regardless of the clock edge or data on D.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down

SN74LVC1G175
Pin/Package 6DSBGA, 6SC70, 6SON, 6SOT-23
Operating Temperature Range(°C) -40 to 85  
IOL(mA) 32  
IOH(mA) -32  
Output Drive(mA) -50,50  
Vcc max(V) 5.5  
Technology Family LVC  
Vcc min(V) 1.65  
Approx. Price (US$) 0.13 | 1ku  
No. of Outputs 1  
tpd max(ns) 3,3.2  
ICC(uA) 10  
Voltage Node(V) 5  
Rating Catalog
SN74LVC1G175 特性
SN74LVC1G175 芯片订购指南
器件 状态 温度 价格(美元) 封装 | 引脚 封装数量 | 封装载体 丝印标记
74LVC1G175DBVRE4 ACTIVE -40 to 85 0.13 | 1ku SOT-23 (DBV) | 6 3000 | LARGE T&R  
74LVC1G175DBVRG4 ACTIVE -40 to 85 0.13 | 1ku SOT-23 (DBV) | 6 3000 | LARGE T&R  
74LVC1G175DBVTE4 ACTIVE -40 to 85 0.46 | 1ku SOT-23 (DBV) | 6 250 | SMALL T&R  
74LVC1G175DBVTG4 ACTIVE -40 to 85 0.46 | 1ku SOT-23 (DBV) | 6 250 | SMALL T&R  
74LVC1G175DCKRE4 ACTIVE -40 to 85 0.13 | 1ku SC70 (DCK) | 6 3000 | LARGE T&R  
74LVC1G175DCKRG4 ACTIVE -40 to 85 0.13 | 1ku SC70 (DCK) | 6 3000 | LARGE T&R  
74LVC1G175DCKTE4 ACTIVE -40 to 85 0.46 | 1ku SC70 (DCK) | 6 250 | SMALL T&R  
74LVC1G175DCKTG4 ACTIVE -40 to 85 0.46 | 1ku SC70 (DCK) | 6 250 | SMALL T&R  
74LVC1G175DRYRG4 ACTIVE -40 to 85 0.18 | 1ku SON (DRY) | 6 5000 | LARGE T&R  
SN74LVC1G175DBVR ACTIVE -40 to 85 0.13 | 1ku SOT-23 (DBV) | 6 3000 | LARGE T&R  
SN74LVC1G175DBVT ACTIVE -40 to 85 0.46 | 1ku SOT-23 (DBV) | 6 250 | SMALL T&R  
SN74LVC1G175DCKR ACTIVE -40 to 85 0.13 | 1ku SC70 (DCK) | 6 3000 | LARGE T&R  
SN74LVC1G175DCKT ACTIVE -40 to 85 0.46 | 1ku SC70 (DCK) | 6 250 | SMALL T&R  
SN74LVC1G175DRYR ACTIVE -40 to 85 0.18 | 1ku SON (DRY) | 6 5000 | LARGE T&R  
SN74LVC1G175YZPR ACTIVE -40 to 85 0.23 | 1ku DSBGA (YFF) | 6 3000 | LARGE T&R  
SN74LVC1G175 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
74LVC1G175DBVRE4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM 74LVC1G175DBVRE4 74LVC1G175DBVRE4
74LVC1G175DBVRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM 74LVC1G175DBVRG4 74LVC1G175DBVRG4
74LVC1G175DBVTE4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM 74LVC1G175DBVTE4 74LVC1G175DBVTE4
74LVC1G175DBVTG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM 74LVC1G175DBVTG4 74LVC1G175DBVTG4
74LVC1G175DCKRE4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM 74LVC1G175DCKRE4 74LVC1G175DCKRE4
74LVC1G175DCKRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM 74LVC1G175DCKRG4 74LVC1G175DCKRG4
74LVC1G175DCKTE4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM 74LVC1G175DCKTE4 74LVC1G175DCKTE4
74LVC1G175DCKTG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM 74LVC1G175DCKTG4 74LVC1G175DCKTG4
74LVC1G175DRYRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM 74LVC1G175DRYRG4 74LVC1G175DRYRG4
SN74LVC1G175DBVR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74LVC1G175DBVR SN74LVC1G175DBVR
SN74LVC1G175DBVT Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74LVC1G175DBVT SN74LVC1G175DBVT
SN74LVC1G175DCKR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74LVC1G175DCKR SN74LVC1G175DCKR
SN74LVC1G175DCKT Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74LVC1G175DCKT SN74LVC1G175DCKT
SN74LVC1G175DRYR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74LVC1G175DRYR SN74LVC1G175DRYR
SN74LVC1G175YZPR Green (RoHS & no Sb/Br)  SNAGCU  Level-1-260C-UNLIM SN74LVC1G175YZPR SN74LVC1G175YZPR
SN74LVC1G175 应用技术支持与电子电路设计开发资源下载
  1. SN74LVC1G175 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器触发器/锁存器/寄存器产品选型与价格 . xls
  3. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
  4. Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
  5. TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
  6. Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
  7. CMOS Power Consumption and CPD Calculation (PDF 89 KB)
  8. Designing With Logic (PDF 186 KB)
  9. Live Insertion (PDF 150 KB)
  10. Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
  11. Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
  12. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  13. LOGIC Pocket Data Book (PDF 6001 KB)
  14. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  15. Logic Cross-Reference (PDF 2938 KB)