SN74LVC2G86 双路 2 输入异或门
This dual 2-input exclusive-OR gate is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC2G86 performs the Boolean function Y = A 
B or Y = AB + AB in positive logic.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
A common application is as a true/complement element. If the input is low, the other input is reproduced in true form at the output. If the input is high, the signal on the other input is reproduced inverted at the output.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down
| SN74LVC2G86 | |
| Pin/Package | 8DSBGA, 8SM8, 8US8 |
| Operating Temperature Range(°C) | -40 to 85 |
| IOL(mA) | 32 |
| IOH(mA) | -32 |
| Input Level | CMOS |
| Vcc max(V) | 5.5 |
| Technology Family | LVC |
| Vcc min(V) | 1.65 |
| Approx. Price (US$) | 0.18 | 1ku |
| Output Level | CMOS |
| No. of Gates | 2 |
| tpd max(ns) | 3.6 |
| ICC(uA) | 10 |
| Rating | Catalog |
SN74LVC2G86 特性
- Available in the Texas Instruments NanoFree™ Package
- Supports 5-V VCC Operation
- Inputs Accept Voltages to 5.5 V
- Max tpd of 4.7 ns at 3.3 V
- Low Power Consumption, 10-µA Max ICC
- ±24-mA Output Drive at 3.3 V
- Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C
- Typical VOHV (Output VOH Undershoot)>2 V at VCC = 3.3 V, TA = 25°C
- Ioff Supports Partial-Power-Down Mode Operation
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
SN74LVC2G86 芯片订购指南
| 器件 | 状态 | 温度 | 价格 | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
| SN74LVC2G86DCTR | ACTIVE | -40 to 85 | 0.18 | 1ku | SM8 (DCT) | 8 | 3000 | LARGE T&R | |
| SN74LVC2G86DCTRE4 | ACTIVE | -40 to 85 | 0.18 | 1ku | SM8 (DCT) | 8 | 3000 | LARGE T&R | |
| SN74LVC2G86DCTRG4 | ACTIVE | -40 to 85 | 0.18 | 1ku | SM8 (DCT) | 8 | 3000 | LARGE T&R | |
| SN74LVC2G86DCUR | ACTIVE | -40 to 85 | 0.18 | 1ku | US8 (DCU) | 8 | 3000 | LARGE T&R | |
| SN74LVC2G86DCURE4 | ACTIVE | -40 to 85 | 0.18 | 1ku | US8 (DCU) | 8 | 3000 | LARGE T&R | |
| SN74LVC2G86DCURG4 | ACTIVE | -40 to 85 | 0.18 | 1ku | US8 (DCU) | 8 | 3000 | LARGE T&R | |
| SN74LVC2G86DCUT | ACTIVE | -40 to 85 | 0.41 | 1ku | US8 (DCU) | 8 | 250 | SMALL T&R | |
| SN74LVC2G86DCUTE4 | ACTIVE | -40 to 85 | 0.41 | 1ku | US8 (DCU) | 8 | 250 | SMALL T&R | |
| SN74LVC2G86DCUTG4 | ACTIVE | -40 to 85 | 0.41 | 1ku | US8 (DCU) | 8 | 250 | SMALL T&R | |
| SN74LVC2G86YZPR | ACTIVE | -40 to 85 | 0.22 | 1ku | DSBGA (YZD) | 8 | 3000 | LARGE T&R |
SN74LVC2G86 质量与无铅数据
| 器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
| SN74LVC2G86DCTR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74LVC2G86DCTR | SN74LVC2G86DCTR |
| SN74LVC2G86DCTRE4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74LVC2G86DCTRE4 | SN74LVC2G86DCTRE4 |
| SN74LVC2G86DCTRG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74LVC2G86DCTRG4 | SN74LVC2G86DCTRG4 |
| SN74LVC2G86DCUR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74LVC2G86DCUR | SN74LVC2G86DCUR |
| SN74LVC2G86DCURE4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74LVC2G86DCURE4 | SN74LVC2G86DCURE4 |
| SN74LVC2G86DCURG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74LVC2G86DCURG4 | SN74LVC2G86DCURG4 |
| SN74LVC2G86DCUT | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74LVC2G86DCUT | SN74LVC2G86DCUT |
| SN74LVC2G86DCUTE4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74LVC2G86DCUTE4 | SN74LVC2G86DCUTE4 |
| SN74LVC2G86DCUTG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74LVC2G86DCUTG4 | SN74LVC2G86DCUTG4 |
| SN74LVC2G86YZPR | Green (RoHS & no Sb/Br) | SNAGCU | Level-1-260C-UNLIM | SN74LVC2G86YZPR | SN74LVC2G86YZPR |
SN74LVC2G86 应用技术支持与电子电路设计开发资源下载
- SN74LVC2G86 数据资料 dataSheet 下载.PDF
- TI 德州仪器门电路产品选型与价格 . xls
- Logic Guide 2009 (PDF 4263 KB)
- Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
- Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
- TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
- Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
- CMOS Power Consumption and CPD Calculation (PDF 89 KB)
- Designing With Logic (PDF 186 KB)
- Live Insertion (PDF 150 KB)
- Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
- Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
- HiRel Unitrode Power Management Brochure (PDF 206 KB)
- LOGIC Pocket Data Book (PDF 6001 KB)
- HiRel Unitrode Power Management Brochure (PDF 206 KB)
- Logic Cross-Reference (PDF 2938 KB)
