TLV5639 12 位,DAC,并行,电压输出,可编程内部 参考,建立时间、功耗、1 通道

TLV5639 说明

The TLV5639 is a 12-bit voltage output digital-to-analog converter (DAC) with a microprocessor compatible parallel interface. It is programmed with a 16-bit data word containing 4 control and 12 data bits. Developed for a wide range of supply voltages, the TLV5639 can be operated from 2.7 V to 5.5 V.

The resistor string output voltage is buffered by a x2 gain rail-to-rail output buffer. The buffer features a ClassAB output stage to improve stability and reduce settling time. The programmable settling time of the DAC allows the designer to optimize speed versus power dissipation. Because of its ability to source up to 1 mA, the internal reference can also be used as a system reference. With its on-chip programmable precision voltage reference, the TLV5639 simplifies overall system design.

DAC7621 TLV5619 TLV5633 TLV5639
Resolution(Bits) 12   12   12   12  
DAC: Channels 1   1   1   1  
Settling Time(µs) 10   1   1   1  
Sample / Update Rate(MSPS) 0.143   1   0.286   0.286  
Interface Parallel   Parallel   Parallel   Parallel  
Output Type Voltage   Voltage   Voltage   Voltage  
Output Range Min.(V or mA) -2.5   0   0   0  
Output Range Max.(V or mA) 2.5   5.1   5.1   5.1  
Single/Dual Analog Supply +   +   +   +  
DNL(Max)(+/-LSB) 1   1   0.5   0.5  
INL(Max)(+/-LSB) 1   4   3   3  
INL (+/-)(Max)(%) 0.024   0.1   0.07   0.07  
Monotonicity 12   12   12   12  
SNR(Typ)(dB)   78   78   78  
SFDR(Typ)(dB)   72   74   74  
Power Consumption(Typ)(mW) 2.5   4.3   2.7   2.7  
Architecture R-2R   String   String   String  
Reference: Type Int/Ext   Ext   Int/Ext   Int/Ext  
Analog Voltage AV/DD(Min)(V) 4.75   2.7   2.7   2.7  
Analog Voltage AV/DD(Max)(V) 5.25   5.5   5.5   5.25  
Logic Voltage DV/DD(Min)(V) 4.75   2.7   2.7   2.7  
Logic Voltage DV/DD(Max)(V) 5.25   5.5   5.5   5.25  
No. of Supplies (Unipolar) 1   1   1   1  
Rating Catalog   Catalog   Catalog   Catalog  
Pin/Package 20SSOP   20SOIC, 20TSSOP   20SOIC, 20TSSOP   20SOIC, 20TSSOP  
Approx. Price (US$) 2.75 | 1ku   4.10 | 1ku   5.90 | 1ku   4.35 | 1ku  
Thermal Shutdown No   No   No   No  
Operating Temperature Range(°C) -40 to 85   -40 to 85,-40 to 125,0 to 70   -40 to 85,0 to 70   -40 to 85,0 to 70
TLV5639 特性
TLV5639 芯片订购指南
器件 状态 温度 (oC) 价格(美元) 封装 | 引脚 封装数量 | 封装载体 丝印标记
TLV5639CDW ACTIVE 0 to 70 4.35 | 1ku SOIC (DW) | 20 25 | TUBE TLV5639C
TLV5639CDWG4 ACTIVE 0 to 70 4.35 | 1ku SOIC (DW) | 20 25 | TUBE TLV5639C
TLV5639CDWR ACTIVE 0 to 70 4.35 | 1ku SOIC (DW) | 20 2000 | LARGE T&R TLV5639C
TLV5639CDWRG4 ACTIVE 0 to 70 4.35 | 1ku SOIC (DW) | 20 2000 | LARGE T&R TLV5639C
TLV5639CPW ACTIVE 0 to 70 4.35 | 1ku TSSOP (PW) | 20 70 | TUBE TV5639
TLV5639CPWG4 ACTIVE 0 to 70 4.35 | 1ku TSSOP (PW) | 20 70 | TUBE TV5639
TLV5639IDW ACTIVE -40 to 85 4.65 | 1ku SOIC (DW) | 20 25 | TUBE TLV5639I
TLV5639IDWG4 ACTIVE -40 to 85 4.65 | 1ku SOIC (DW) | 20 25 | TUBE TLV5639I
TLV5639IPW ACTIVE -40 to 85 5.10 | 1ku TSSOP (PW) | 20 70 | TUBE TY5639
TLV5639IPWG4 ACTIVE -40 to 85 5.10 | 1ku TSSOP (PW) | 20 70 | TUBE TY5639
TLV5639IPWR ACTIVE -40 to 85 4.65 | 1ku TSSOP (PW) | 20 2000 | LARGE T&R TY5639
TLV5639IPWRG4 ACTIVE -40 to 85 4.65 | 1ku TSSOP (PW) | 20 2000 | LARGE T&R TY5639
TLV5639 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
TLV5639CDW Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM   TLV5639CDW
TLV5639CDWG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TLV5639CDWG4 TLV5639CDWG4
TLV5639CDWR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM   TLV5639CDWR
TLV5639CDWRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TLV5639CDWRG4 TLV5639CDWRG4
TLV5639CPW Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM   TLV5639CPW
TLV5639CPWG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TLV5639CPWG4 TLV5639CPWG4
TLV5639IDW Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM   TLV5639IDW
TLV5639IDWG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TLV5639IDWG4 TLV5639IDWG4
TLV5639IPW Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM   TLV5639IPW
TLV5639IPWG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TLV5639IPWG4 TLV5639IPWG4
TLV5639IPWR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM   TLV5639IPWR
TLV5639IPWRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TLV5639IPWRG4 TLV5639IPWRG4
TLV5639 应用技术支持与电子电路设计开发资源下载
  1. TLV5639 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器仪DAC 模数转换器产品选型与价格 . xls
  3. 模数规格和性能特性术语表 (Rev. A) (PDF 1993 KB)
  4. 所选封装材料的热学和电学性质 (PDF 645 KB)
  5. 高速数据转换 (PDF 1967 KB)
  6. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
  7. Analog-to-Digital Converter Grounding Practices Affect System Performance (PDF 56 KB)
  8. Principles of Data Acquisition and Conversion (PDF 50 KB)
  9. Interleaving Analog-to-Digital Converters (PDF 64 KB)
  10. What Designers Should Know About Data Converter Drift (PDF 95 KB)
  11. Giving Delta-Sigma Converters a Gain Boost with a Front End Analog Gain Stage (PDF 70 KB)
  12. Programming Tricks for Higher Conversion Speeds Utilizing Delta Sigma Converters (PDF 105 KB)
TLV5639 工具与软件
名称 型号 公司 工具/软件类型
TLV5619-TLV5639EVM 评估模块 TLV5619-TLV5639EVM Texas Instruments 开发电路板/EVM
针对 Code Composer Studio 的 DCPFREETOOL 软件插件 DCPFREETOOL Texas Instruments 实用程序/插件
MDACBufferPro Design Utility for Multiplying Digital to Analog Converter Design MDACBUFFERPRO Texas Instruments  应用软件