UC1611 四路肖特基二极管阵列

UC1611 描述

This four-diode array is designed for general purpose use as individual diodes or as a high-speed, high-current bridge. It is particularly useful on the outputs of high-speed power MOSFET drivers where Schottky diodes are needed to clamp any negative excursions caused by ringing on the driven line.These diodes are also ideally suited for use as voltage clamps when driving inductive loads such as relays and solenoids, and to provide a path for current free-wheeling in motor drive applications.The use of Schottky diode technology features high efficiency through lowered forward voltage drop and decreased reverse recovery time.This single monolithic chip is fabricated in both hermetic CERDIP and copper-eaded plastic packages.

UC1611
Output Current(A) 3  
Vin(V) 0  
Vin(Max)(V) 50  
Rating Catalog
UC1611 特性
UC1611 芯片订购指南
器件 状态 温度 (oC) 价格(美元) 封装 | 引脚 封装数量 | 封装载体 丝印标记
UC1611N ACTIVE -40 to 85 3.30 | 1ku PDIP (P) | 8 50 | TUBE UC1611N
UC1611NG4 ACTIVE -40 to 85 3.30 | 1ku PDIP (P) | 8 50 | TUBE UC1611N
UC1611 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
UC1611N Pb-Free (RoHS)  CU NIPDAU  N/A for Pkg Type UC1611N UC1611N
UC1611NG4 Pb-Free (RoHS)  CU NIPDAU  N/A for Pkg Type UC1611NG4 UC1611NG4
UC1611 应用技术支持与电子电路设计开发资源下载
  1. UC1611 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器NVSRAM(非易失性 SRAM)产品选型与价格 . xls
  3. PowerPAD™ Thermally Enhanced Package   (PDF  1040 KB)
  4. 全面认识开关型电源中的BUCK-BOOST功率级 (Rev. A)   (PDF  2206 KB)
  5. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
  6. PowerPAD™ Made Easy (PDF 57 KB)
  7. 标准线性产品交叉参考 (Rev. D)   (PDF  1058 KB)
  8. 模数规格和性能特性术语表 (Rev. A) (PDF 1993 KB)
  9. 所选封装材料的热学和电学性质 (PDF 645 KB)
  10. 高速数据转换 (PDF 1967 KB)
UC1611 相关工具
名称 型号 公司 工具/软件类型
UC1611 评估模块 UC1611EVM Texas Instruments 开发电路板/EVM