TGA2507-SM	
TGA2507-SM_EVB.dxf Autocad layer naming convention: 	
(units: mils)	

Top Copper Layer:	TOPMETAL
Bottom Copper Layer:	BOTMETAL
Top Soldermask Layer:	TOPSOLDERMASK
Bottom Soldermask Layer:	BOTSOLDERMASK
Top Silkscreen Printing:	TOPSILKSCREEN
Board Outline:	OUTLINE
Drill: 	DRILL  

Gerber Layer File name conventions:	
* = TGA2507-SM_EVB 	 
(units: inches)	
Top Copper Layer: 	*_TOPMETAL.gbr
Bottom Copper Layer:	*_BOTMETAL.gbr
Top Soldermask Layer:	*_TOPSOLDERMASK.gbr
Bottom Soldermask Layer: 	*_BOTSOLDERMASK.gbr
Top Silkscreen Printing: 	*_TOPSILKSCREEN.gbr
Board Outline: 	*_OUTLINE.gbr
Gerber Drill:	*_DRILL.gbr
NC Drill:	*.drl

TGA2507-SM_EVB Board Specifications: 	
1. 1 insulating layers - Rogers RO4003C .008" thick. 	
2. 2 1/2 oz copper layers (top and bottom layers) with patterning on  both layers	
3. Plating: Immersion gold suitable for lead free soldering top and bottom copper layers	
4. Topside soldermask layer - Color: Blue	
5. Topside silkscreen layer (AS REQUIRED)	
6. Boards to be arrayed in a panel for scribe and break.	
7. All drill holes < .060 ae PTH (plated through holes).	
8. All drill holes > .060 may be either  PTH (plated through holes) or NPT (non plated through holes).	
9. Artwork represents single board. Panelize this artwork using the artwork	
   in the OUTLINE Autocad layer and *_OUTLINE.gbr Gerber file as the border of the board.	


	

