TGL2201-SM	
TGL2201-SM_EVB_RevA.dxf Autocad layer naming convention: 	
(units: mils)	

Top Copper Layer:	TOPMETAL
Bottom Copper Layer:	BOTMETAL
Top Soldermask Layer:	TOPSOLDERMASK
Top Silkscreen Printing:	TOPSILKSCREEN
Board Outline:	OUTLINE
Drill: 	DRILL  
Solder paste stencil: STENCIL

Gerber Layer File name conventions:	
* = TGL2201-SM_EVB_RevA 	 
(units: inches)	
Top Copper Layer: 	*_TOPMETAL.gbr
Bottom Copper Layer:	*_BOTMETAL.gbr
Top Silkscreen Printing: 	*_TOPSILKSCREEN.gbr
Board Outline: 	*_OUTLINE.gbr
Gerber Drill:	*_DRILL.gbr
NC Drill:	_DRILL.drl
Solder paste stencil: *_STENCIL.gbr

TGL2201-SM_EVB Board Specifications: 	
1. 1 insulating layers - Rogers RO4003C .008" thick. 	
2. 2 of 1 oz copper layers (top and bottom layers) with patterning on  top layer.  Bottom is solid layer of Cu.	
3. Plating: Immersion gold suitable for lead free soldering top and bottom copper layers	
4. Topside soldermask layer - Color: Blue.  No backside soldermask.	
5. Topside silkscreen layer - Color: white	
6. Boards to be arrayed in a panel for scribe and break.	
7. Artwork represents single board. Panelize this artwork using the artwork	
   in the OUTLINE Autocad layer and *_OUTLINE.gbr Gerber file as the border of the board.
8. All drill holes < .020 are PTH (plated through holes).	
9. All drill holes > .020 may be either  PTH (plated through holes) or NPT (non plated through holes).		
10. Artwork represents single board. Panelize this artwork using the artwork		
   in the OUTLINE Autocad layer and *_OUTLINE.gbr Gerber file as the border of the board.
11. Stencil artwork designed for 0.004" thick stencil
	
	

	

	


	

