EMIF09-SD01F3:9-line EMI filter and ESD protection for mini and micro SD card interfaces

The EMIF09-SD01F3 is a highly integrated array designed to suppress EMI/RFI noise for secure digital memory cards. The EMIF09-SD01F3 is in a Flip Chip package to offer space saving and high RF performance.

This low-pass filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 15 kV. This filter also has a low line capacitance to be compatible with high data rate signals.

Key Features

  • High reliability offered by monolithic integration
  • Very thin package: 0.6 mm
  • 9-line EMI low-pass filter and ESD protection
  • Lead-free package
  • High efficiency in EMI filtering
  • Very low PCB space occupation: < 4 mm2
  • Reduction of parasitic elements thanks to CSP integration
  • 400 µm pitch
Product Specifications
DescriptionVersionSize
DS4522: 9-line IPAD™, EMI filter and ESD protection3.0373 KB
Application Notes
DescriptionVersionSize
AN4541: EMI filters for SD3.0 card high-speed SD card protection and filtering devices1.11 MB
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use5.0261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use8.0251 KB
Technical Notes & Articles
DescriptionVersionSize
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches4.0330 KB
Flyers
DescriptionVersionSize
Single chip IPADTM memory card transceiver1.0567 KB
Sample & Buy
Part NumberPackagePacking TypeUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
EMIF09-SD01F3Chip Scale Package 0.4mm pitchTape And Reel0.5731000NECEAR99CHINA
Quality & Reliability
Part NumberPackageGradeRoHS Compliance GradeMaterial Declaration**
EMIF09-SD01F3Chip Scale Package 0.4mm pitchIndustrialEcopack2md_0z-wspc-csps0.4-wspc-21-25_k90z-wspc-emi9t1b.pdf
md_0z-wspc-csps0.xml
9-line IPAD™, EMI filter and ESD protection EMIF09-SD01F3
EMI filters for SD3.0 card high-speed SD card protection and filtering devices EMIF03-SIM05F3
IPAD™ 400 µm Flip Chip: package description and recommendations for use HSP061-4M10
IPAD™ 500 µm Flip Chip: package description and recommendations for use CPL-WBF-00D3
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches FLC21
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches EMIF03-SIM02F3
md_0z-wspc-csps0.4-wspc-21-25_k90z-wspc-emi9t1b.pdf EMIF09-SD01F3
md_0z-wspc-csps0.xml EMIF10-LCD02F3