HMC-XTB110 Passive x3 Frequency Multiplier, 24 - 30 GHz Input

The HMC-XTB110 is a monolithic x3 Passive Frequency Multiplier which utilizes GaAs Shottky Diode technology, and exhibits low conversion loss and high Fo isolation. This wideband x3 multiplier requires no DC power, and is targeted to high volume applications where frequency x3 of a lower frequency is more economical than directly generating a higher frequency. All bond pads and the die backside are Ti/Au metallized and the Shottky diode devices are fully passivated for reliable operation. The HMC-XTB110 Passive x3 MMIC is compatible with conventional die attach methods, as well as thermocompression and thermosonic wire bonding, making it ideal for MCM and hybrid microcircuit applications. All data shown herein is measured with the chip in a 50 Ohm environment and contacted with RF probes.

技术特性
  • Conversion Loss: 19 dB
  • Input Drive: +13 dBm
  • Passive: No DC Bias Required
  • Die Size: 1.1 x 1.4 x 0.1 mm
订购信息 Ordering Information
  • HMC-XTB110
应用领域 APPLICATION
  • FCC E-Band Communication Systems
  • Short-Haul / High Capacity Radios
  • Automotive Radar
  • Test & Measurement Equipment

技术指标
Input Freq. (GHz) Function Output Freq. (GHz) Conv. Loss (dB) 1Fo / 4Fo Isolation (dB) Input Drive (dBm) Package
24 - 30 Passive x3 72 - 90 19 - +13 Chip
功能框图 Functional Block Diagram

HMC-XTB110 功能框图

应用技术支持与电子电路设计开发资源下载 版本信息 大小
HMC-XTB110 数据资料DataSheet下载:pdf Rev.V2 2 页