MA4AGSBP907 AlGaAs Solder Bump Flip-Chip PIN Diode

M/A-COM's MA4AGSBP907 is an aluminum gallium arsenide flip-chip PIN diode with solder bumps. These devices are fabricated on OMCVD epitaxial wafers using a process designed for high device uniformity and extremely low parasitics. The diodes exhibit an extremely low RC product, 0.1ps and 2nS switching characteristics. The useable frequency range is 100MHz to 40GHz. They are fully passivated with silicon nitride and have an additional layer of a polymer for scratch protection. The protective coating prevents damage to the junction and the anode airbridge during handling and circuit attachment.

技术特性 Features

Low Resistance
Ultra Low Capacitance
Millimeter Wave Switching & Cutoff Frequency
2 Nanosecond Switching Speed
Can be Driven by a Buffered TTL
Silicon Nitride Passivation
Polyimide Scratch Protection
RoHS Compliant
Solderable Bump Die Attach

MA4AGSBP907 产品实物图

订购信息 Ordering Information

MA4AGSBP907 Die in Carrier

应用技术支持与电子电路设计开发资源下载	版本信息	大小
MA4AGSBP907 数据资料DataSheet下载.PDF	Rev.V2	2 页
MA4AGSBP907:S 参数		85K