BC817-25QA; BC817-40QA: 45 V,500 mA NPN通用晶体管

500 mA NPN通用晶体管,采用无引脚超小型DFN1010D-3 (SOT1215)表面贴装器件(SMD)塑料封装,具有可见且可焊的侧焊盘。

sot1215_3d
数据手册 (1)
名称/描述Modified Date
45 V, 500 mA NPN general-purpose transistors (REV 1.0) PDF (205.0 kB) BC817-25QA_40QA [English]03 Sep 2013
手册 (1)
名称/描述Modified Date
NXP® MOSFETs and bipolar transistors in DFN1010; Small and Powerful (REV 1.0) PDF (1.8 MB) 75017485 [English]04 Nov 2013
封装信息 (1)
名称/描述Modified Date
DFN1010D-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 1.1 x 1.0 x 0.37 mm (REV 1.0) PDF (191.0 kB) SOT1215 [English]08 Feb 2016
可靠性与质量信息 (4)
名称/描述Modified Date
BC817-25QA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC817-25QA_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BC817-40QA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC817-40QA_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BC817-25QA NXP® Product Reliability (REV 1.0) PDF (87.0 kB) BC817-25QA [English]16 Jul 2014
BC817-40QA NXP® Product Reliability (REV 1.0) PDF (87.0 kB) BC817-40QA [English]16 Jul 2014
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态
BC817-25QAActive
BC817-40QAActive
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BC817-40QASOT1215Reflow_Soldering_ProfileReel 7" Q2/T3ActiveBC817-40QAZ (9340 671 58147)10 11 00BC817-40QAAlways Pb-free153.00.711.41E911
Reel 7" Q1/T1WithdrawnBC817-40QAX (9340 671 58115)10 11 00BC817-40QAAlways Pb-free153.00.711.41E911
BC817-25QASOT1215Reflow_Soldering_ProfileReel 7" Q2/T3ActiveBC817-25QAZ (9340 671 56147)11 01 00BC817-25QAAlways Pb-free153.00.711.41E911
Reel 7" Q1/T1WithdrawnBC817-25QAX (9340 671 56115)11 01 00BC817-25QAAlways Pb-free153.00.711.41E911
45 V, 500 mA NPN general-purpose transistors BC817-40QA
NXP® MOSFETs and bipolar transistors in DFN1010; Small and Powerful PBSS5260QA
BC817-25QA NXP Product Quality BC817-25QA
BC817-40QA NXP Product Quality BC817-40QA
BC817-25QA NXP® Product Reliability BC817-25QA
BC817-40QA NXP® Product Reliability BC817-40QA
BC817-25QA SPICE model BC817-25QA
BC817-40QA SPICE model BC817-40QA
DFN1010D-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 1.1 x 1.0 x 0.37 mm PBSS5260QA
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
LOW_RDSON_MOSFETS_IN_ULTRA_SMALL_DFN1010_SINGLE_AND_DUAL_PACKAGE