BC817-25QA; BC817-40QA: 45 V, 500 mA NPN general-purpose transistors
500 mA NPN general-purpose transistors in a leadless ultra small DFN1010D-3 (SOT1215) Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.
sot1215_3d
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 45 V, 500 mA NPN general-purpose transistors (REV 1.0) PDF (205.0 kB) BC817-25QA_40QA [English] | 03 Sep 2013 |
Brochures (1)
| Name/Description | Modified Date |
|---|---|
| NXP® MOSFETs and bipolar transistors in DFN1010; Small and Powerful (REV 1.0) PDF (1.8 MB) 75017485 [English] | 04 Nov 2013 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| DFN1010D-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 1.1 x 1.0 x 0.37 mm (REV 1.0) PDF (191.0 kB) SOT1215 [English] | 08 Feb 2016 |
Reliability and Quality Information (4)
| Name/Description | Modified Date |
|---|---|
| BC817-25QA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC817-25QA_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BC817-40QA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC817-40QA_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BC817-25QA NXP® Product Reliability (REV 1.0) PDF (87.0 kB) BC817-25QA [English] | 16 Jul 2014 |
| BC817-40QA NXP® Product Reliability (REV 1.0) PDF (87.0 kB) BC817-40QA [English] | 16 Jul 2014 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE model
- BC817-25QA SPICE model (REV 1.0) TXT BC817-25QA_1 9/6/2013
- BC817-40QA SPICE model (REV 1.0) TXT BC817-40QA_1 9/6/2013
Ordering Information
| Product | Status |
|---|---|
| BC817-25QA | Active |
| BC817-40QA | Active |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC817-40QA | | SOT1215 | Reflow_Soldering_Profile | Reel 7" Q2/T3 | Active | BC817-40QAZ (9340 671 58147) | 10 11 00 | BC817-40QA |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 7" Q1/T1 | Withdrawn | BC817-40QAX (9340 671 58115) | 10 11 00 | BC817-40QA | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||||
| BC817-25QA | | SOT1215 | Reflow_Soldering_Profile | Reel 7" Q2/T3 | Active | BC817-25QAZ (9340 671 56147) | 11 01 00 | BC817-25QA | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 7" Q1/T1 | Withdrawn | BC817-25QAX (9340 671 56115) | 11 01 00 | BC817-25QA | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- 45 V, 500 mA NPN general-purpose transistors BC817-40QA
- NXP® MOSFETs and bipolar transistors in DFN1010; Small and Powerful PBSS5260QA
- BC817-25QA NXP Product Quality BC817-25QA
- BC817-40QA NXP Product Quality BC817-40QA
- BC817-25QA NXP® Product Reliability BC817-25QA
- BC817-40QA NXP® Product Reliability BC817-40QA
- BC817-25QA SPICE model BC817-25QA
- BC817-40QA SPICE model BC817-40QA
- DFN1010D-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 1.1 x 1.0 x 0.37 mm PBSS5260QA
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- LOW_RDSON_MOSFETS_IN_ULTRA_SMALL_DFN1010_SINGLE_AND_DUAL_PACKAGE
