BCP69-25: 20 V,2 A PNP中等功率晶体管

PNP中等功率晶体管,采用SOT223表面贴装器件(SMD)塑料封装。NPN补充产品:BCP68。

BCP69-25: 产品结构框图
BCP69-25: 应用结构框图
SOT223
数据手册 (1)
名称/描述Modified Date
20 V, 2 A PNP medium power transistors (REV 7.1) PDF (253.0 kB) BCP69_BC869_BC69PA [English]20 Oct 2011
手册 (1)
名称/描述Modified Date
Medium-power general-purpose transistors (REV 1.0) PDF (892.0 kB) 75017660 [English]26 May 2015
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 [English]08 Feb 2016
包装 (2)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115 [English]07 Nov 2012
Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (189.0 kB) SOT223_135 [English]07 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
BCP69-25 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP69-25_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BCP69-25 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP69-25_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
支持信息 (2)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
Design Support
SPICE
软件
订购信息
型号状态Package versionPackage name大小 (mm)ComplementPtot (mW)IC [max] (mA)IC max (mA)PolarityPtot [max] (mW)VCEO [max] (V)hFE maxfT [min] (MHz)hFE [max]hFE [min]
BCP69-25ActiveSOT223SC-736.5 x 3.5 x 1.65BCP68-251000PNP135020140375160
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BCP69-25SOT223Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 11¼" Q1/T1 in LargePackActiveBCP69-25,135 (9339 693 90135)BCP69/25BCP69-25week 34, 2003153.00.711.41E911
Reel 7" Q1/T1ActiveBCP69-25,115 (9339 693 90115)BCP69/25BCP69-25week 34, 2003153.00.711.41E911
20 V, 2 A PNP medium power transistors BCP69-25
Medium-power general-purpose transistors BSR43
BCP69-25 NXP Product Quality BCP69-25
BCP69-25 NXP® Product Reliability BCP69-25
Letter Symbols - Transistors; General PEMD16
Power Derating Curves for SMDs; General BST62
BCP69-25 SPICE model BCP69-25
BCP69_1_2 BCP69-25
plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55
Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A
PBHV9115Z
PBHV9115Z
BLT81