BCP69-25: 20 V, 2 A PNP medium power transistor
PNP medium power transistor in a SOT223 Surface-Mounted Device (SMD) plastic package. NPN complement: BCP68.
BCP69-25: Product Block Diagram
BCP69-25: Block Diagram
SOT223
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 20 V, 2 A PNP medium power transistors (REV 7.1) PDF (253.0 kB) BCP69_BC869_BC69PA | 20 Oct 2011 |
Brochures (1)
| Name/Description | Modified Date |
|---|---|
| Medium-power general-purpose transistors (REV 1.0) PDF (892.0 kB) 75017660 | 26 May 2015 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 | 08 Feb 2016 |
Packing (2)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115 | 07 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (189.0 kB) SOT223_135 | 07 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| BCP69-25 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP69-25_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
| BCP69-25 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP69-25_NXP_PRODUCT_RELIABILITY | 31 Jan 2015 |
Supporting Information (2)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
Design Support
- Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999
- Power Derating Curves for SMDs; General (REV 0.1) PDF DERATSMD_1 5/7/1999
SPICE model
- BCP69-25 SPICE model (REV 1.4) prm BCP69-25 7/22/2012
Software
- BCP69_1_2 (REV 0.1) olb BCP69_1_2 11/21/2008
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | Ptot (mW) | Complement | IC [max] (mA) | Polarity | IC max (mA) | Ptot [max] (mW) | hFE max | VCEO [max] (V) | fT [min] (MHz) | hFE [max] | hFE [min] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BCP69-25 | Active | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | BCP68-25 | 1000 | PNP | 1350 | 20 | 140 | 375 | 160 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BCP69-25 | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11¼" Q1/T1 in LargePack | Active | BCP69-25,135 (9339 693 90135) | BCP69/25 | BCP69-25 |    | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 7" Q1/T1 | Active | BCP69-25,115 (9339 693 90115) | BCP69/25 | BCP69-25 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- Medium-power general-purpose transistors BSR43
- BCP69-25 NXP Product Quality BCP69-25
- BCP69-25 NXP® Product Reliability BCP69-25
- Letter Symbols - Transistors; General PEMD16
- Power Derating Curves for SMDs; General BST62
- BCP69-25 SPICE model BCP69-25
- BCP69_1_2 BCP69-25
- plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55
- Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A
- PBHV9115Z
- PBHV9115Z
- BLT81
