BCP68; BC868; BC68PA: 20 V，2 A NPN中等功率晶体管
NPN中等功率晶体管系列，采用表面贴装器件(SMD)塑料封装。
SOT089
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| 20 V, 2A NPN medium power transistors (REV 8.0) PDF (1.2 MB) BCP68_BC868_BC68PA [English] | 02 Nov 2011 |
手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| Medium-power general-purpose transistors (REV 1.0) PDF (892.0 kB) 75017660 [English] | 26 May 2015 |
封装信息 (3)
| 名称/描述 | Modified Date |
|---|---|
| DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (185.0 kB) SOT1061 [English] | 08 Feb 2016 |
| plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 [English] | 08 Feb 2016 |
| plastic surface-mounted package; die pad for good heat transfer; 3 leads (REV 1.0) PDF (193.0 kB) SOT89 [English] | 08 Feb 2016 |
包装 (4)
| 名称/描述 | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (178.0 kB) SOT89_115 [English] | 28 Nov 2012 |
| DFN2020-3; reel pack; standard product orientation; 12NC ending 115 (REV 1.0) PDF (261.0 kB) SOT1061_115 [English] | 07 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115 [English] | 07 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (189.0 kB) SOT223_135 [English] | 07 Nov 2012 |
可靠性与质量信息 (12)
| 名称/描述 | Modified Date |
|---|---|
| BC68-25PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC68-25PA [English] | 31 Jan 2015 |
| BC68-25PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC68-25PA_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BC68PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC68PA_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BC68PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC68PA_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BC868-25 NXP Product Quality (REV 1.2) PDF (74.0 kB) BC868-25_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BC868-25 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC868-25_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BC868 NXP Product Quality (REV 1.2) PDF (74.0 kB) BC868_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BC868 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC868_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BCP68-25 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP68-25_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCP68-25 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP68-25_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BCP68 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP68_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BCP68 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP68_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
Design Support
- Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999
- Power Derating Curves for SMDs; General (REV 0.1) PDF DERATSMD_1 5/7/1999
SPICE
- BC68-25PA SPICE model (REV 1.4) prm BC68-25PA_1 7/22/2012
- BC68PA SPICE model (REV 1.4) prm BC68PA 7/22/2012
- BC868 SPICE model (REV 1.4) prm BC868 7/22/2012
- BC868-25 SPICE model (REV 1.4) prm BC868-25 7/22/2012
- BCP68 SPICE model (REV 1.4) prm BCP68 7/22/2012
- BCP68-25 SPICE model (REV 1.4) prm BCP68-25 7/22/2012
订购信息
| 型号 | 状态 |
|---|---|
| BC68PA | Active |
| BC868 | Active |
| BCP68-25 | Active |
| BC868-25 | Active |
| BC68-25PA | Active |
| BCP68 | Active |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC868 | | SOT89 | Reel 7" Q1/T1 | Active | BC868,115 (9336 787 70115) | CAC | BC868 |    | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | |
| BC68-25PA |  | SOT1061 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | BC68-25PA,115 (9340 657 37115) | AS | BC68-25PA | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| BC868-25 | | SOT89 | Reel 7" Q1/T1 | Active | BC868-25,115 (9340 053 80115) | CDC | BC868-25 | | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | |
| BC68PA | | SOT1061 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | BC68PA,115 (9340 657 36115) | AR | BC68PA | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| BCP68-25 |  | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11¼" Q1/T1 in LargePack | Active | BCP68-25,135 (9339 693 70135) | BCP68/25 | BCP68-25 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 7" Q1/T1 | Active | BCP68-25,115 (9339 693 70115) | BCP68/25 | BCP68-25 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||||
| BCP68-25/ZL | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11¼" Q1/T1 in LargePack | Active | BCP68-25/ZLF (9340 707 26135) | Standard Marking | BCP68-25/ZL | 153.0 | 0.71 | 1.41E9 | ||||
| Reel 7" Q1/T1 | Active | BCP68-25/ZLX (9340 707 26115) | Standard Marking | BCP68-25/ZL | 153.0 | 0.71 | 1.41E9 | ||||||||
| BCP68 | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | BCP68,115 (9339 686 60115) | BCP68 | BCP68 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 11¼" Q1/T1 in LargePack | Active | BCP68F (9339 686 60135) | BCP68 | BCP68 | 153.0 | 0.71 | 1.41E9 | ||||||||
| BCP68/ZL | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11¼" Q1/T1 in LargePack | Active | BCP68/ZLF (9340 707 17135) | Standard Marking | BCP68/ZL | 153.0 | 0.71 | 1.41E9 | ||||
| Reel 7" Q1/T1 | Active | BCP68/ZLX (9340 707 17115) | Standard Marking | BCP68/ZL | 153.0 | 0.71 | 1.41E9 |
- Medium-power general-purpose transistors BSR43
- BC68-25PA NXP® Product Reliability BC68-25PA
- BC68-25PA NXP Product Quality BC68-25PA
- BC68PA NXP Product Quality BC68PA
- BC68PA NXP® Product Reliability BC68PA
- BC868-25 NXP Product Quality BC868-25
- BC868-25 NXP® Product Reliability BC868-25
- BC868 NXP Product Quality BC868
- BC868 NXP® Product Reliability BC868
- BCP68-25 NXP Product Quality BCP68-25
- BCP68-25 NXP® Product Reliability BCP68-25
- BCP68 NXP Product Quality BCP68
- BCP68 NXP® Product Reliability BCP68
- Letter Symbols - Transistors; General PEMD16
- Power Derating Curves for SMDs; General BST62
- BC68-25PA SPICE model BCP68_BC868_BC68PA
- BC68PA SPICE model BCP68_BC868_BC68PA
- BC868 SPICE model BCP68_BC868_BC68PA
- BC868-25 SPICE model BCP68_BC868_BC68PA
- BCP68 SPICE model BCP68_BC868_BC68PA
- BCP68-25 SPICE model BCP68-25
- plastic surface-mounted package; die pad for good heat transfer; 3 leads BZV49-C9V1
- Tape reel SMD; standard product orientation 12NC ending 115 BZV49-C9V1
- DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm PMEG6020EPA
- DFN2020-3; reel pack; standard product orientation; 12NC ending 115 PMEG6020EPA
- plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55
- Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A
- BFU590Q
- PTVSXU1UPA_SERIES
- BLT81
