BAL-2690D3U:50Ω / 30+j25 balun transformer for 2.45 GHz ISM band

The BAL-2690D3U is a balun designed to transform single ended signals to differential signals in Bluetooth applications.

The BAL-2690D3U has been customized for the STLC2690 Bluetooth transceiver with 0.8 dB insertion losses in the bandwidth(2400 MHz - 2500 MHz) and with a specific requirement for the SCC22 parameter.

The BAL-2690D3U has been designed using STMicroelectronics IPD (integrated passive device) technology on non conductive glass substrate to optimize RF performance.

Key Features

  • 50 Ω nominal input / 30+j25 output differential impedance
  • Low insertion loss
  • Low amplitude imbalance
  • Low phase imbalance
  • Small footprint: BAL-2690D3U < 1 mm²
产品规格
DescriptionVersionSize
DS6408: 50 Ω nominal input / conjugate match balun to STLC26903.0472 KB
应用手册
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AN4315: BAL-NRF02D3 matched balun with integrated harmonics filter for Nordic Semiconductor chips with ultralow power transceivers2.1688 KB
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use5.0261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use8.0251 KB
Technical Notes & Articles
DescriptionVersionSize
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches4.0330 KB
宣传册
DescriptionVersionSize
High-quality RF IPD baluns for ISM bands simplify RF complexity.2.01 MB
IPADTM – integrated passive devices for RF applications2.11 MB
手册
DescriptionVersionSize
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样片和购买
型号PackagePacking TypeMinimum Sellable QuantityUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
BAL-2690D3UChip Scale Package 0.4mm pitchTape And Reel50000.1681000NECEAR99CHINA
质量和可靠性
型号PackageGradeRoHS Compliance GradeMaterial Declaration**
BAL-2690D3UChip Scale Package 0.4mm pitchIndustrialEcopack2md_6(-wspc-cspg-wspc-0.4_ld6(-wspc-bt1lc2a.pdf
md_6(-wspc-cspg-wspc-0.xml
50 Ω nominal input / conjugate match balun to STLC2690 BAL-2690D3U
BAL-NRF02D3 matched balun with integrated harmonics filter for Nordic Semiconductor chips with ultralow power transceivers BAL-NRF02D3
IPAD™ 400 µm Flip Chip: package description and recommendations for use HSP061-4M10
IPAD™ 500 µm Flip Chip: package description and recommendations for use CPL-WBF-00D3
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches FLC21
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches BAL-NRF02D3
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches CPL-WB-00C2
STEVAL-SPIMD20V1 demonstration kit based on the SPIMD20 integrated motor drive STEVAL-SPIMD20V1
STM8L101xx device limitations STM8L101G3
md_6(-wspc-cspg-wspc-0.4_ld6(-wspc-bt1lc2a.pdf BAL-2690D3U
md_6(-wspc-cspg-wspc-0.xml CPL-WBF-00D3