BALF-NRF01E3:50Ω nominal input / conjugate match balun to nRF51x22-QFAA, nRF51x22-QFAC, nRF51822-QFABBx and nRF51422-QFABAx with integrated filter

STMicroelectronics BALF-NRF01E3 is an ultraminiature balun. The BALF-NRF01E3 integrates matching network in a monolithic glass substrate. Matching impedance has been customized for the nRF51822-QFAA/AB/AC and nRF51422-QFAA/AB/AC RF transceivers.

It uses STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF performance.

Key Features

  • Low insertion loss
  • Low amplitude imbalance
  • Low phase imbalance
  • Coated CSP on glass
  • Small footprint: < 1.5 mm2
  • Benefits
    • Very low profile
    • High RF performance
    • PCB space saving versus discrete solution
    • BOM count reduction
    • Efficient manufacturability
产品规格
DescriptionVersionSize
DS10702: 50 Ω nominal input / conjugate match balun to nRF51822-QFAA/AB/AC and nRF51422-QFAA/AB/AC with integrated filter3.0578 KB
应用手册
DescriptionVersionSize
AN4315: BAL-NRF02D3 matched balun with integrated harmonics filter for Nordic Semiconductor chips with ultralow power transceivers2.1688 KB
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use5.0261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use8.0251 KB
Technical Notes & Articles
DescriptionVersionSize
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches4.0330 KB
宣传册
DescriptionVersionSize
High-quality RF IPD baluns for ISM bands simplify RF complexity.2.01 MB
手册
DescriptionVersionSize
Products and Solutions for Factory Automation and Control1.03 MB
Semiconductor solutions for healthcare applications1.0665 KB
样片和购买
型号PackagePacking TypeMinimum Sellable QuantityUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
BALF-NRF01E3FLIP CHIP BUMPLESS CSPGTape And Reel50000.132100NECEAR99CHINA
质量和可靠性
型号PackageGradeRoHS Compliance GradeMaterial Declaration**
BALF-NRF01E3FLIP CHIP BUMPLESS CSPGIndustrialEcopack2md_a03l-wspc-cspg-wspc-bumpless_lz3lblnrf1d.pdf
md_a03l-wspc-cspg-wspc-bumpless_lz3lblnrf1d.xml
50 Ω nominal input / conjugate match balun to nRF51822-QFAA/AB/AC and nRF51422-QFAA/AB/AC with integrated filter BALF-NRF01E3
BAL-NRF02D3 matched balun with integrated harmonics filter for Nordic Semiconductor chips with ultralow power transceivers BAL-NRF02D3
IPAD™ 400 µm Flip Chip: package description and recommendations for use HSP061-4M10
IPAD™ 500 µm Flip Chip: package description and recommendations for use CPL-WBF-00D3
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches FLC21
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches BAL-NRF02D3
STEVAL-SPIMD20V1 demonstration kit based on the SPIMD20 integrated motor drive STEVAL-SPIMD20V1
STM8L101xx device limitations STM8L101G3
md_a03l-wspc-cspg-wspc-bumpless_lz3lblnrf1d.pdf BALF-NRF01E3
md_a03l-wspc-cspg-wspc-bumpless_lz3lblnrf1d.xml BALF-NRF01E3