DIP1524-01D3:GPS/GLONASS and 2.4 GHz diplexer

The DIP1524-01D3 is a diplexer designed to separate the RF received signals of the GPS-GLONASS from the RF received signals in the 2.4 to 2.7 GHz band.

The DIP1524-01D3 has been designed using STMicroelectronics IPD (Integrated Passive Device) technology on non conductive glass substrate to optimize RF performance.

Key Features

  • Low insertion loss
  • High attenuation levels
  • Input power for GPS: 25 dBm max
  • Input power for WLAN: 28 dBm max
  • High power capacity
  • Lead-free, Flip-Chip package
  • Small footprint
  • Very low profile (< 630 μm thickness)
  • High RF performance
产品规格
DescriptionVersionSize
DS8780: GPS/GLONASS and 2.4 GHz diplexer2.0181 KB
应用手册
DescriptionVersionSize
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use5.0261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use8.0251 KB
Technical Notes & Articles
DescriptionVersionSize
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches4.0330 KB
手册
DescriptionVersionSize
Semiconductor solutions for healthcare applications1.0665 KB
样片和购买
型号PackagePacking TypeMinimum Sellable QuantityUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
DIP1524-01D3Chip Scale Package 0.4mm pitchTape And Reel50000.0941000NECEAR99CHINA
质量和可靠性
型号PackageGradeRoHS Compliance GradeMaterial Declaration**
DIP1524-01D3Chip Scale Package 0.4mm pitchIndustrialEcopack2md_6(-wspc-cspg-wspc-0.4_ld6(dip0120-wspc-(dip1524-01d3).pdf
md_6(-wspc-cspg-wspc-0.xml
GPS/GLONASS and 2.4 GHz diplexer DIP1524-01D3
IPAD™ 400 µm Flip Chip: package description and recommendations for use HSP061-4M10
IPAD™ 500 µm Flip Chip: package description and recommendations for use CPL-WBF-00D3
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches FLC21
STM8L101xx device limitations STM8L101G3
md_6(-wspc-cspg-wspc-0.4_ld6(dip0120-wspc-(dip1524-01d3).pdf DIP1524-01D3
md_6(-wspc-cspg-wspc-0.xml CPL-WBF-00D3