DIP2450-01D3:2 G / 5 G WLAN diplexer

This diplexer targets the use of dual band 2.4 GHz and 5 GHz. The DIP2450-01D3 is a diplexer dedicated to the WLAN/BT application.

It is designed using STMicroelectronics IPD (integrated passive device) technology on non conductive glass substrate to optimize RF performance.

Key Features

  • Low insertion loss in pass band
  • High attenuation levels
  • High rejection of out-of-band frequencies
  • Small footprint: < 1.4 mm2
  • Benefits
    • Very low profile (<600 μm after reflow)
    • High Q, low loss
    • High RF performance
    • Tight tolerance
    • Bill of materials and area reduction
产品规格
DescriptionVersionSize
DS9039: 2 G / 5 G WLAN diplexer2.0268 KB
应用手册
DescriptionVersionSize
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use5.0261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use8.0251 KB
Technical Notes & Articles
DescriptionVersionSize
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches4.0330 KB
手册
DescriptionVersionSize
Semiconductor solutions for healthcare applications1.0665 KB
样片和购买
型号PackagePacking TypeMinimum Sellable QuantityUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
DIP2450-01D3Chip Scale Package 0.4mm pitchTape And Reel50000.12351000NECEAR99CHINA
质量和可靠性
型号PackageGradeRoHS Compliance GradeMaterial Declaration**
DIP2450-01D3Chip Scale Package 0.4mm pitchIndustrialEcopack2md_a0jf-wspc-csps-wspc-bumpless_kzjf6tansc1.pdf
md_a0jf-wspc-csps-wspc-bumpless_kzjf6tansc1.xml
2 G / 5 G WLAN diplexer DIP2450-01D3
IPAD™ 400 µm Flip Chip: package description and recommendations for use HSP061-4M10
IPAD™ 500 µm Flip Chip: package description and recommendations for use CPL-WBF-00D3
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches FLC21
STM8L101xx device limitations STM8L101G3
md_a0jf-wspc-csps-wspc-bumpless_kzjf6tansc1.pdf DIP2450-01D3
md_a0jf-wspc-csps-wspc-bumpless_kzjf6tansc1.xml DIP2450-01D3