EMIF02-MIC02F3:2-line EMI filter and ESD protection for microphones

The EMIF02-MIC02F3 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference.

This filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 15 kV.

Key Features

  • High reliability offered by monolithic integration
  • High efficiency ESD suppression
  • EMI symmetrical (I/O) low-pass filter
  • Lead-free package
  • High efficiency EMI filtering
  • Very thin package: 0.60 mm
  • High reduction of parasitic elements through integration and wafer level packaging
  • Very low PCB space consumption: 0.9 mm2
产品规格
DescriptionVersionSize
DS4612: 2-line IPAD™, EMI filter including ESD protection2.1177 KB
应用手册
DescriptionVersionSize
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use5.0261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use8.0251 KB
Technical Notes & Articles
DescriptionVersionSize
TN1200: Micro-bump Flip Chip: package description and recommendations for use1.0280 KB
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches4.0330 KB
宣传册
DescriptionVersionSize
Enhanced ESD protection and EMI filters for audio/video interfaces1.0823 KB
The ultimate HDMI control-link buffer2.1478 KB
样片和购买
型号PackagePacking TypeUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
EMIF02-MIC02F3Chip Scale Package 0.4mm pitchTape And Reel0.2581000NECEAR99CHINA
质量和可靠性
型号PackageGradeRoHS Compliance GradeMaterial Declaration**
EMIF02-MIC02F3Chip Scale Package 0.4mm pitchIndustrialEcopack2md_k0-wspc-csps0.4-wspc-4-6_kdk0emi2t1n-wspc-(emif02-mic02f3)-wspc-wcp-wspc-ver2_signed.pdf
md_k0-wspc-csps0.4-wspc-4-6_kdk0emi2t1n-wspc-(emif02-mic02f3)-wspc-wcp-wspc-ver2.xml
2-line IPAD™, EMI filter including ESD protection EMIF02-MIC02F3
IPAD™ 400 µm Flip Chip: package description and recommendations for use HSP061-4M10
IPAD™ 500 µm Flip Chip: package description and recommendations for use CPL-WBF-00D3
Micro-bump Flip Chip: package description and recommendations for use ESDAXLC6-1BU2
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches FLC21
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches EMIF02-MIC06F3
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches EMIF02-MIC06F3
md_k0-wspc-csps0.4-wspc-4-6_kdk0emi2t1n-wspc-(emif02-mic02f3)-wspc-wcp-wspc-ver2_signed.pdf EMIF02-MIC02F3
md_k0-wspc-csps0.4-wspc-4-6_kdk0emi2t1n-wspc-(emif02-mic02f3)-wspc-wcp-wspc-ver2.xml EMIF02-MIC02F3