EMIF02-SPK03F2:2-channel EMI filter and ESD protection for speaker phone

The EMIF02-SPK03F2 chip is a highly integrated device designed to suppress EMI/RFI noise for interface line filtering.

The EMIF02-SPK03F2 is 2-channel, ultra compact, high attenuation filter available in 0.5 mm pitch WLCSP package. Additionally, this filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 30 kV.

Key Features

  • 2-channel EMI symmetrical (I/O) low-pass filter
  • High efficiency in EMI filtering:
    • S21 attenuation, -40 dB at 900 MHz
    • Xtalk, in audio band, -60 dB
  • Very low PCB space consumption: 0.89 x 1.26 mm
  • Very thin package: 0.6 mm after reflow
  • High efficiency in ESD suppression on input pins (IEC 61000-4-2 level 4)
  • High reliability offered by monolithic integration
  • High reduction of parasitic elements through integration and wafer level packaging
  • Packaged in lead-free Flip Chip
  • Complies with the following standards
    • IEC 61000-4-2 level 4:
      • ±15 kV (air discharge)
      • ±8 kV (contact discharge)
    • ±8 kV (contact discharge)
产品规格
DescriptionVersionSize
DS9051: 2-channel EMI filter and ESD protection for speaker phone1.0278 KB
应用手册
DescriptionVersionSize
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use5.0261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use8.0251 KB
Technical Notes & Articles
DescriptionVersionSize
TN1200: Micro-bump Flip Chip: package description and recommendations for use1.0280 KB
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches4.0330 KB
HW Model & CAD Libraries
DescriptionVersionSize
EMIF02-SPK03F2 S-parameter model (.sxp)1.0218 KB
手册
DescriptionVersionSize
Semiconductor solutions for healthcare applications1.0665 KB
样片和购买
型号PackagePacking TypeUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
EMIF02-SPK03F2Chip Scale Package 0.5mm pitchTape And Reel0.228100NECEAR99CHINA
质量和可靠性
型号PackageGradeRoHS Compliance GradeMaterial Declaration**
EMIF02-SPK03F2Chip Scale Package 0.5mm pitchIndustrialEcopack2md_qa-wspc-csps0.5-wspc-4-6_kdqaem2t16b-wspc-(emif02-spk03f2).pdf
md_qa-wspc-csps0.xml
2-channel EMI filter and ESD protection for speaker phone EMIF02-SPK03F2
IPAD™ 400 µm Flip Chip: package description and recommendations for use HSP061-4M10
IPAD™ 500 µm Flip Chip: package description and recommendations for use CPL-WBF-00D3
Micro-bump Flip Chip: package description and recommendations for use ESDAXLC6-1BU2
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches FLC21
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches EMIF02-SPK03F2
STM8L101xx device limitations STM8L101G3
md_qa-wspc-csps0.5-wspc-4-6_kdqaem2t16b-wspc-(emif02-spk03f2).pdf EMIF02-SPK03F2
md_qa-wspc-csps0.xml EMIF02-SPK03F2