EMIF06-VID01F2:6-line EMI filter and ESD protection for display interfaces

The EMIF06-VID01F2 is a 6-line highly integrated array designed to suppress EMI / RFI noise in all systems subjected to electromagnetic interference.

The EMIF06-VID01F2 Flip Chip packaging means the package size is equal to the die size.

Additionally, this filter includes ESD protection circuitry which prevents damage to the protected device when subjected to ESD surges up to 15 kV.

Key Features

  • High efficiency in ESD suppression on inputs pins (IEC 61000-4-2 level 4)
  • Very thin package: 0.65 mm
  • High reduction of parasitic elements through integration and wafer level packaging
  • High efficiency EMI filtering (-40 dB @ 900 MHz)
  • Low serial resistance for camera impedance adaptation
  • Low line capacitance suitable for high speed data bus
  • Optimized PCB space occupation: 2.92 mm x 1.29 mm
  • High reliability offered by monolithic integration
  • Lead-free package
产品规格
DescriptionVersionSize
DS4228: 6-line IPAD™, low capacitance EMI filter and ESD protection2.1166 KB
应用手册
DescriptionVersionSize
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use5.0261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use8.0251 KB
Technical Notes & Articles
DescriptionVersionSize
TA0318: EMI and ESD consideration for LCD and cameras in wireless handsets1.2115 KB
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches4.0330 KB
样片和购买
型号PackagePacking TypeUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
EMIF06-VID01F2Chip Scale Package 0.5mm pitchTape And Reel0.314100NECEAR99CHINA
质量和可靠性
型号PackageGradeRoHS Compliance GradeMaterial Declaration**
EMIF06-VID01F2Chip Scale Package 0.5mm pitchIndustrialEcopack2md_qc-wspc-csps0.5-wspc-11-16_kdqc-wspc-emi6t4f_vers2_sdm.pdf
6-line IPAD™, low capacitance EMI filter and ESD protection EMIF06-VID01F2
IPAD™ 400 µm Flip Chip: package description and recommendations for use HSP061-4M10
IPAD™ 500 µm Flip Chip: package description and recommendations for use CPL-WBF-00D3
EMI and ESD consideration for LCD and cameras in wireless handsets EMIF08-1005M16
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches FLC21
md_qc-wspc-csps0.5-wspc-11-16_kdqc-wspc-emi6t4f_vers2_sdm.pdf EMIF06-VID01F2